Solid-state imaging apparatus and camera using the same

Abstract

A solid-state imaging device and one or more bare ICs disposed on a back face of a solid-state imaging apparatus. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. The IC chips may be disposed on the inner surface, mainly the ceiling surface, of a light-shielding case. The imaging apparatus may be within a package with a pinhole.

What is claimed is: 
     
         1 . A solid-state imaging apparatus comprising:
 a circuit board;   a solid-state imaging device mounted on one surface of a circuit board;   a light-shielding member covering the one surface of the circuit board, the light-shielding member having an opening for allowing light coming from an object to reach the solid-state imaging device;   an imaging forming configuration that forms an image of the object on a front face of the solid-state imaging device; and   circuitry for the solid-state imaging device mounted on an inner surface of the light-shielding member.   
     
     
         2 . The solid-state imaging apparatus according to  claim 1 , wherein the image forming configuration comprises a lens. 
     
     
         3 . The solid-state imaging apparatus according to  claim 1 , wherein the image forming configuration comprises the opening. 
     
     
         4 . The solid-state imaging apparatus of  claim 1 , wherein the circuitry comprises an integrated circuit chip. 
     
     
         5 . The solid-state imaging apparatus of  claim 1 , wherein the circuitry comprises electronic parts. 
     
     
         6 . The solid-state imaging apparatus of  claim 1 , wherein the circuitry comprises an integrated circuit chip and electronic parts.