Heat sink assembly

Abstract

An exemplary heat sink assembly includes a base plate for thermally contacting an electronic component and fins protruded from the base plate to dissipate heat transferred from the base plate by nature convection and thermal radiation. A heat conductive film is formed on an outer surface of the heat sink. A thermal radiation wavelength region of a far and middle infrared ray is located in a thermal radiation wavelength region of the heat conductive film.

What is claimed is: 
     
         1 . A heat sink assembly, comprising:
 a heat sink adapted for thermally contacting an electronic component; and   a heat conductive film formed on an outer surface of the heat sink, a thermal radiation wavelength of the heat conductive film being located in a far and middle infrared ray wavelength region.   
     
     
         2 . The heat sink assembly of  claim 1 , wherein a heat conductivity coefficient of the heat conductive film is higher than that of the heat sink. 
     
     
         3 . The heat sink assembly of  claim 1 , wherein the heat conductive film is formed by metallic oxide. 
     
     
         4 . The heat sink assembly of  claim 3 , wherein the heat conductive film is formed by aluminum oxide, magnesium oxide, titanium oxide, or a combination thereof. 
     
     
         5 . The heat sink assembly of  claim 1 , wherein a thermal emissivity of the heat conductive film is varied between 0.8 to 1.0. 
     
     
         6 . The heat sink assembly of  claim 1 , wherein a thermal radiation wavelength of the heat conductive film is varied between 2.5 micrometers to 1000 micrometers. 
     
     
         7 . The heat sink assembly of  claim 1 , wherein the heat conductive film entirely covers the outer surface of the heat sink. 
     
     
         8 . The heat sink assembly of  claim 1 , wherein the heat sink is integrally formed by aluminum, copper or an alloy thereof. 
     
     
         9 . The heat sink assembly of  claim 8 , wherein the heat sink comprises a base plate and a plurality of fins protruded from a side of the base plate. 
     
     
         10 . A heat sink assembly, comprising:
 a heat sink comprises a base plate adapted for thermally contacting an electronic component and a plurality of fins protruded from the base plate to dissipate heat transferred from the base plate by nature convection and thermal radiation; and   a heat conductive film formed on an outer surface of the heat sink, a thermal radiation wavelength of the heat conductive film being in a range from 2.5 micrometers to 1000 micrometers.   
     
     
         11 . The heat sink assembly of  claim 10 , wherein a thermal emissivity of the heat conductive film is varied between 0.8 to 1.0. 
     
     
         12 . The heat sink assembly of  claim 10 , wherein a thermal radiation wavelength of the heat conductive film is varied between 2.5 micrometers to 1000 micrometers. 
     
     
         13 . The heat sink assembly of  claim 10 , wherein the heat conductive film entirely covers outer surfaces of the base plate and the fins. 
     
     
         14 . The heat sink assembly of  claim 10 , wherein the fins are spaced from each other and parallel to each other.