Methods and apparatus for nanolapping

Abstract

A lapping system for lapping portions of a workpiece. The lapping system includes, a lap that is defined by a surface. Portions of the surface are a lapping surface. The lapping surface has a coating that enhances material removal from a workpiece in a lapping process. The lapping system further includes, a scanning probe microscope having a tip and a substrate. The scanning probe microscope controls lapping motion of the lap and workpiece.

1 . A lapping system for lapping portions of a workpiece, the system comprising:
 a lap being defined by a surface, wherein portions of the surface are a lapping surface; and wherein the lapping surface has a coating; wherein the coating enhances material removal from a workpiece in a lapping process; and   a scanning probe microscope having a tip and a substrate;   wherein the scanning probe microscope controls lapping motion of the lap and workpiece.   
     
     
         2 . The lapping system of  claim 1  wherein the lap is the tip and the workpiece is the substrate. 
     
     
         3 . The lapping system of  claim 1  wherein the lap is the substrate and the workpiece is the tip. 
     
     
         4 - 17 . (canceled) 
     
     
         18 . A lap having a lapping surface for lapping portions of a workpiece, the lap comprising:
 a plurality of lap segments, wherein each lap segment has a lapping surface; and wherein the lapping surfaces of the lap segments are oriented to form the lapping surface of the lap.   
     
     
         19 - 21 . (canceled) 
     
     
         22 . The lap of claim  20  wherein the lapping surface of the lap is a track having a polygonal shape; and
 the track is bounded by a space defined by a cube having edge dimensions of about 200 μm or less. 
 
     
     
         23 . A method of fabricating a lap, the method comprising:
 cutting a silicon wafer along the 110 crystallographic plane;   etching a track of a first shape in the silicon wafer, the track has a first sidewall, a second sidewall, and a bottom surface, the first and second of sidewalls being approximately perpendicular to a top surface of the silicon wafer;   cutting the silicon wafer in a plurality of pieces; and   arranging the plurality of pieces to form the lap;   wherein the lap has another track having second shape; and   the other track is a lapping surface   
     
     
         24 . The method of  claim 23  wherein the other track is bounded by a space defined by a cube having edge dimensions of about 200 μm or less. 
     
     
         25 - 27 . (canceled) 
     
     
         28 . A lap having a lapping surface for imparting shape onto portions of a workpiece, the lap comprising:
 a body; and   a set of surface portions bounding the body;   wherein the lapping surface is comprised of a subset of the surface portions; and   the lapping surface is bounded by a space defined by a space defined by a cube having edge dimensions of about 200 μm or less.   
     
     
         29 . The lap of  claim 28  and further comprising at least another lapping surface comprised of a another subset of the surface portions;
 wherein the other lapping surface is bounded by a space defined by a cube having edge dimensions of about 200 μm or less. 
 
     
     
         30 . The lap of  claim 29  wherein the lapping surface forms a first track and the other lapping surfaces forms a second track. 
     
     
         31 - 86 . (canceled) 
     
     
         87 . A lapping method for lapping portions of a workpiece, the method comprising:
 controlling movement of the workpiece and a first lap relative to each other with a scanning probe microscope;   controlling movement of the workpiece and a second lap relative to each other with a scanning probe microscope;   lapping the workpiece into a first shape with the first lap; and   lapping the workpiece into a second shape with the second lap.   
     
     
         88 - 122 . (canceled)