Laminated polishing pad

Abstract

The purpose of the present invention is to provide a long-lived laminated polishing pad wherein a polishing layer is resistant to detachment from a support layer even when high temperatures are produced by long periods of polishing. This laminated polishing pad is characterized that: a polishing layer and a support layer are laminated together with an adhesive member interposed therebetween; said adhesive member is either an adhesive layer containing a polyester-based hot-melt adhesive or double-sided tape that has one of such adhesive layers on each side of a substrate; and for each 100 weight parts of a polyester-resin base polymer, said polyester-based hot-melt adhesive contains 2 to 10 weight parts of an epoxy resin that has at least two glycidyl groups per molecule.

1 . A laminated polishing pad, comprising a support layer, an adhesive member, and a polishing layer placed on the support layer with the adhesive member interposed therebetween, wherein the adhesive member is an adhesive layer containing a polyester-based hot-melt adhesive or a double-sided tape comprising a backing and the adhesive layer provided on each of both sides of the backing, wherein the polyester-based hot-melt adhesive contains 100 parts by weight of a polyester resin as a base polymer and 2 to 10 parts by weight of an epoxy resin having two or more glycidyl groups per molecule. 
     
     
         2 . The laminated polishing pad according to  claim 1 , wherein the polyester resin is a crystalline polyester resin. 
     
     
         3 . The laminated polishing pad according to  claim 1 , wherein the polishing layer and the support layer each have an opening, the laminated polishing pad further comprising a transparent member placed in the opening of the polishing layer and bonded to the adhesive member. 
     
     
         4 . The laminated polishing pad according to  claim 1 , wherein the adhesive layer has a thickness of 10 μm to 200 μm. 
     
     
         5 . The laminated polishing pad according to  claim 1 , wherein the backing is a resin film having a rate of dimensional change of 1.2% or less between before and after it is heated at 150° C. for 30 minutes. 
     
     
         6 . The laminated polishing pad according to  claim 1 , wherein the support layer is a high modulus layer made of a resin film having a rate of dimensional change of 1.2% or less between before and after it is heated at 150° C. for 30 minutes. 
     
     
         7 . The laminated polishing pad according to  claim 1 , wherein the support layer is a cushion layer, the laminated polishing pad further comprising a resin film provided on one side of the cushion layer and having a rate of dimensional change of 1.2% or less between before and after it is heated at 150° C. for 30 minutes. 
     
     
         8 . The laminated polishing pad according to  claim 1 , wherein the polishing layer has a surface with an arithmetic mean roughness (Ra) of 1 μm to 15 μm on which the adhesive member is placed. 
     
     
         9 . The laminated polishing pad according to  claim 1 , having a shearing stress of 200 N/25 mm square or more at 80° C. between the polishing layer and the support layer. 
     
     
         10 . A laminated polishing pad, comprising a polishing layer, an adhesive member, a support layer, and a double-sided adhesive sheet stacked in this order, and further comprising a transparent member placed in a hole through the polishing layer, the adhesive member, and the support layer and placed on the double-sided adhesive sheet, wherein the adhesive member is an adhesive layer containing a polyester-based hot-melt adhesive or a double-sided tape comprising a backing and the adhesive layer provided on each of both sides of the backing, Wherein the polyester-based hot-melt adhesive contains 100 parts by weight of a polyester resin as a base polymer and 2 to 10 parts by weight of an epoxy resin having two or more glycidyl groups per molecule. 
     
     
         11 . A method for manufacturing a laminated, polishing pad, comprising the steps of: stacking, a polishing layer and a support layer with an adhesive member interposed therebetween to form a laminated polishing sheet; forming, a through hole in the laminated polishing sheet; bonding a double-sided adhesive sheet to the support layer of the laminated polishing sheet having the through hole; and placing a transparent member in the through hole and on the double-sided adhesive sheet, wherein
 the adhesive member is an adhesive layer containing a polyester-based hot-melt adhesive or a double-sided tape comprising a backing and the adhesive layer provided on each of both sides of the backing, wherein the polyester-based hot-melt adhesive contains 100 parts by weight of a polyester resin as a base polymer and 2 to 10 parts by weight of an epoxy resin having two or more glycidyl groups per molecule.   
     
     
         12 . A method for manufacturing a semiconductor device, comprising the step of polishing a surface of a semiconductor wafer using the laminated polishing pad according to  claim 1 .