Bidirectional heat dissipation structure

Abstract

A bidirectional heat dissipation structure includes a base, a plurality of heat pipes and a heat sink having a plurality of cooling fins. The cooling fins are installed with an interval apart on the heat pipes and stacked onto the base, and each cooling fin includes at least one guide slat. When assembled, a horizontal diversion channel is formed between the cooling fins, and the guide slats form a downward diversion channel. When used, a portion of the wind current dissipates the heat of the heat sink through the horizontal diversion channel, and the other portion of the wind current blows downwardly through the downward diversion channel to dissipate the heat around the electronic device directly, so as to enhance the heat dissipation efficiency significantly.

What is claimed is: 
     
         1 . A bidirectional heat dissipation structure, installed onto an electronic device, and having a wind source disposed on a side of the bidirectional heat dissipation structure, comprising:
 a base, disposed on the electronic device;   a plurality of heat pipes, extended in a direction from the base; and   a heat sink, having a plurality of cooling fins, each cooling fin sequentially passing through the heat pipes, and the cooling fins being stacked with each other above the base, and the cooling fin having a plurality of through holes for passing the heat pipes, and the cooling fin having at least one guide slat;   thereby a horizontal diversion channel is formed between the cooling fins when the bidirectional heat dissipation structure is assembled, and the guide slats form a downward diversion channel between the cooling fins; and the wind source supplies wind from a lateral side, and a portion of wind current dissipates heat through the horizontal diversion channel, and the other portion of the wind current blows downwardly to dissipate heat of the electronic device through the downward diversion channel.   
     
     
         2 . The bidirectional heat dissipation structure of  claim 1 , wherein the base includes a plurality of grooves corresponsive to the heat pipes and the grooves parallelly and transversely penetrate a side of the base. 
     
     
         3 . The bidirectional heat dissipation structure of  claim 2 , wherein the heat pipes are substantially U-shaped with the central position disposed in the grooves respectively, so that both ends of each heat pipe are vertically erected from the base. 
     
     
         4 . The bidirectional heat dissipation structure of  claim 1 , wherein each of the through holes has a circular flange disposed around the through hole. 
     
     
         5 . The bidirectional heat dissipation structure of  claim 1 , wherein the cooling fin has a baffle plate disposed on a side of the cooling fin. 
     
     
         6 . The bidirectional heat dissipation structure of  claim 5 , wherein each guide slat has a predetermined included angle with respect to each baffle plate, and the predetermined included angle falls within a range from 30° to 89°. 
     
     
         7 . The bidirectional heat dissipation structure of  claim 5 , wherein each guide slat has a predetermined gap from each baffle plate. 
     
     
         8 . The bidirectional heat dissipation structure of  claim 1 , wherein the guide slat is an arc sheet structure or a rectangular sheet structure. 
     
     
         9 . The bidirectional heat dissipation structure of  claim 1 , wherein the guide slat is extended in a direction towards a side of the cooling fin and an included angle is defined between the guide slat and the cooling fin. 
     
     
         10 . The bidirectional heat dissipation structure of  claim 1 , wherein the cooling fin has at least one penetrating hole formed at a lateral edge of the guide slat and communicated with the downward diversion channel, so that the other portion of the wind current is blown downwardly through the downward diversion channel and the penetrating holes for dissipating heat around the electronic device.