Microelectromechanical system (mems) and (mem) optical interferometer for hyper-spectral imaging and analysis

Abstract

A microelectromechanical system (MEMS) ( 10 ), and a microelectromechanical (MEM) optical interferometer ( 18 ), for hyper-spectral imaging and analysis. System ( 10 ) includes matrix configured collimating micro lens ( 16 ), for receiving and collimating electromagnetic radiation ( 60 ) emitted by objects ( 12 ) in a scene or sample ( 14 ); microelectromechanical optical interferometer ( 18 ), for forming divided collimated object emission beam ( 72 ) having an optical path difference, and for generating an interference image exiting optical interferometer ( 18 ); matrix configured focusing micro lens ( 20 ); micro detector ( 22 ), for detecting and recording generated interference images; and micro central programming and signal processing unit ( 24 ). Applicable for on-line (e.g., real time or near-real time) or off-line hyper-spectral imaging and analyzing, on a miniaturized or ‘micro’ (sub-centimeter [1 cm (10 mm) or less], or sub-millimeter) scale, essentially any types or kinds of biological, physical, or/and chemical, (i.e., biophysicochemical) objects.

What is claimed is: 
     
         1 . A microelectromechanical system for hyper-spectral imaging and analysis, comprising:
 a matrix configured collimating micro lens, configured and suitable for receiving and collimating electromagnetic radiation emitted by objects in a scene or a sample, thereby forming a collimated object emission beam;   a microelectromechanical optical interferometer, configured and operatively positioned relative to said matrix configured collimating micro lens, and suitable for receiving and dividing said collimated object emission beam, for forming a divided collimated object emission beam having an optical path difference, and for generating an interference image exiting said optical interferometer;   a matrix configured focusing micro lens, configured for focusing each said generated interference image;   a micro detector, configured and operatively positioned relative to said microelectromechanical optical interferometer, and suitable for detecting and recording each said generated interference image, for forming a plurality of recorded interference images; and   a micro central programming and control/data/information signal processing unit (micro-CPPU).   
     
     
         2 . The microelectromechanical system of  claim 1 , wherein said microelectromechanical optical interferometer includes:
 a micro beam splitter;   a micro fixed mirror;   a micro movable mirror;   a micro piezoelectric motor;   a micro distance change feedback sensor;   a micro piezoelectric motor controller, configured and operatively connected to said micro piezoelectric motor and to said micro distance change feedback sensor; and   a micro optical interferometer mount, configured and suitable as a mount of said micro beam splitter, said micro fixed mirror, said micro movable mirror, said micro piezoelectric motor, and said micro distance change feedback sensor.   
     
     
         3 . The system of  claim 1 , wherein said matrix configured collimating micro lens is configured and operatively positioned for being part of, and included in, said microelectromechanical optical interferometer. 
     
     
         4 . The system of  claim 3 , wherein said micro optical interferometer mount is additionally configured and suitable as a mount of said matrix configured collimating micro lens. 
     
     
         5 . The system of  claim 1 , wherein said micro optical interferometer mount is made of a material including a micro etched surface. 
     
     
         6 . The system of  claim 5 , wherein said material is selected from the group consisting of micro etchable semi-metallic materials, micro etchable non-metallic materials, and micro etchable metallic materials. 
     
     
         7 . The system of  claim 6 , wherein said micro etchable semi-metallic material is selected from the group consisting of micro etchable silicon materials and micro etchable silicon-like materials. 
     
     
         8 . The system of  claim 5 , wherein said micro etched surface of said material includes one or more micro etched portions whereupon are mounted at least one of said micro beam splitter, said micro fixed mirror, said micro movable mirror, said micro piezoelectric motor, and said micro distance change feedback sensor. 
     
     
         9 . The system of  claim 8 , wherein said micro etched surface includes an additional micro etched portion whereupon is mounted said matrix configured collimating micro lens. 
     
     
         10 . The system of  claim 5 , wherein said micro etched surface of said material includes a portion covered by a first metallic micro layer, and wherein surface of said first metallic micro layer includes a portion covered by a second metallic micro layer, such that said micro piezoelectric motor and said micro movable mirror are mounted upon a portion of said second metallic micro layer. 
     
     
         11 . The system of  claim 10 , wherein said first metallic micro layer is a gold layer. 
     
     
         12 . The system of  claim 10 , wherein said second metallic micro layer is a PZT (lead zirconate titanate) type material. 
     
     
         13 . A microelectromechanical optical interferometer for hyper-spectral imaging and analysis, comprising:
 a micro beam splitter, onto which a collimated object emission beam of electromagnetic radiation emitted by objects in a scene or a sample is incident, and by which said collimated object emission beam is divided into two beams;   a micro fixed mirror, configured and operatively positioned relative to said micro beam splitter;   a micro movable mirror, configured and operatively positioned relative to said micro fixed mirror and to said micro beam splitter, whereby said micro fixed mirror and said micro movable mirror receive and reflect said two beams in a manner such that said two beams exiting said micro optical interferometer have an optical path difference;   a micro piezoelectric motor, configured and operatively connected to said micro movable mirror, and suitable for displacing said micro movable mirror along an axis of said divided collimated object emission beam;   a micro distance change feedback sensor, configured and operatively connected to said micro movable mirror, and suitable for sensing and measuring change in distance of said micro movable mirror along said axis;   a micro piezoelectric motor controller, configured and operatively connected to said micro piezoelectric motor and to said micro distance change feedback sensor, and suitable for actuating and controlling said micro piezoelectric motor; and   a micro optical interferometer mount, configured and suitable as a mount of said micro beam splitter, said micro fixed mirror, said micro movable mirror, said micro piezoelectric motor, and said micro distance change feedback sensor.   
     
     
         14 . The microelectromechanical optical interferometer of  claim 13 , further including a matrix configured collimating micro lens, wherein said matrix configured collimating micro lens is configured and suitable for receiving and collimating said electromagnetic radiation emitted by said objects in said scene or said sample, thereby forming said collimated object emission beam. 
     
     
         15 . The microelectromechanical optical interferometer of  claim 14 , wherein said micro optical interferometer mount is additionally configured and suitable as a mount of said matrix configured collimating micro lens. 
     
     
         16 . The microelectromechanical optical interferometer of  claim 13 , wherein said micro beam splitter is selected from the group consisting of a rectangular shaped micro beam splitter and a cubic shaped micro beam splitter. 
     
     
         17 . The microelectromechanical optical interferometer of  claim 13 , wherein said micro optical interferometer mount is made of a material including a micro etched surface. 
     
     
         18 . The microelectromechanical optical interferometer of  claim 17 , wherein said material is selected from the group consisting of micro etchable semi-metallic materials, micro etchable non-metallic materials, and micro etchable metallic materials. 
     
     
         19 . The microelectromechanical optical interferometer of  claim 18 , wherein said micro etchable semi-metallic material is selected from the group consisting of micro etchable silicon materials and micro etchable silicon-like materials. 
     
     
         20 . The microelectromechanical optical interferometer of  claim 17 , wherein said micro etched surface of said material includes one or more micro etched portions whereupon are mounted at least one of said micro beam splitter, said micro fixed mirror, said micro movable mirror, said micro piezoelectric motor, and said micro distance change feedback sensor. 
     
     
         21 . The microelectromechanical optical interferometer of  claim 20 , wherein said micro etched surface includes an additional micro etched portion whereupon is mounted said matrix configured collimating micro lens. 
     
     
         22 . The microelectromechanical optical interferometer of  claim 17 , wherein said micro etched surface of said material includes a portion covered by a first metallic micro layer, and wherein surface of said first metallic micro layer includes a portion covered by a second metallic micro layer, such that said micro piezoelectric motor and said micro movable mirror are mounted upon a portion of said second metallic micro layer. 
     
     
         23 . The microelectromechanical optical interferometer of  claim 22 , wherein said first metallic micro layer is a gold layer. 
     
     
         24 . The microelectromechanical optical interferometer of  claim 22 , wherein said second metallic micro layer is a PZT (lead zirconate titanate) type material.