Conductive pattern formation

Abstract

A system and method for forming conductive lines on a substrate comprising depositing a precursor onto at least a portion of the substrate, depositing a thin layer of conductive material over the precursor, forming a negative-patterned mask over a portion of the thin layer of conductive material to form an exposed pattern, forming conductive lines in the exposed pattern, removing the patterned mask thereby uncovering an exposed portion of the conductive layer that substantially corresponds to the negative pattern portion, and removing the exposed portion of the conductive layer so as to uncover substrate that substantially corresponds to the exposed portion.

1 - 9 . (canceled) 
     
     
         10 . A structure, comprising:
 a substrate;   active palladium disposed on at least a portion of the substrate;   a thin layer of conductive material disposed over the active palladium; and   a set of conductive lines disposed over the thin layer of conductive material.   
     
     
         11 . The structure of  claim 10 , wherein the active palladium is disposed monoatomically on the substrate. 
     
     
         12 . The structure of  claim 10 , wherein the thin layer of conductive material has a thickness of less than 4 micrometers. 
     
     
         13 . The structure of  claim 10 , wherein the thin layer of conductive material is a conductive seed layer having a thickness of between 0.025 and 2 micrometers. 
     
     
         14 . The structure of  claim 10 , wherein a thickness of the conductive lines is greater than a thickness of the thin layer of conductive material. 
     
     
         15 . The structure of  claim 10 , further comprising a removable negative-patterned mask formed over a portion of the thin layer of conductive material to form an exposed pattern, wherein the set of conductive lines is disposed within the exposed pattern. 
     
     
         16 . The structure of  claim 10 , wherein the substrate is a flexible substrate having an elastic modulus less than about 1 GPa. 
     
     
         17 . The structure of  claim 10 , wherein the substrate is included in the housing of a portable electronics device. 
     
     
         18 - 26 . (canceled)