US2014087135A1PendingUtilityA1

In-mold label and method for producing the same

Assignee: NANYA PLASTICS CORPPriority: Oct 13, 2010Filed: Dec 2, 2013Published: Mar 27, 2014
Est. expiryOct 13, 2030(~4.2 yrs left)· nominal 20-yr term from priority
B29L 2031/744B32B 2307/75B32B 2519/00B32B 27/32Y10T428/24355B29C 43/222B29C 55/143B32B 2250/03B32B 2307/538B32B 3/30B32B 2307/408B29K 2023/10B32B 27/08B32B 2250/242B32B 2307/518B29C 59/04B29C 59/10
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Claims

Abstract

Provided is an in-mold label and a method for producing the in-mold label which has a heat-sealable resin layer with a plurality of interlaced and continuous-arranged micro-protrusions. While the in-mold label is combined on a surface of a specific article, the micro-protrusions may provide multiple blister-exhausting paths. As a result, it is effective to drive out the blisters as combining the label and the article. The in-mold label particularly includes a substrate made of a thermoplastic resin material, a printed layer on the substrate's one surface, and the other surface made of heat-sealable resin. With an embossing process, the heat-sealable resin layer having the interlaced and continuous-arranged micro-protrusions is formed. The in-mold label can be sealed to the article surface excellently since the micro-protrusions form the multiple paths for exhausting the blisters effectively.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An in-mold label, comprising:
 a substrate;   a printed layer, formed on a first surface of the substrate for displaying printed content;   a heat-sealable layer, formed on a second surface of the substrate, and a plurality of interlaced and continuous-arranged micro-protrusions formed on the heat-sealable layer by a heating-embossing-cooling process for forming a plurality of blister-exhausting paths;   wherein, while the in-mold label is combined with surface of an article, the interlaced and continuous-arranged micro-protrusions on the heat-sealable layer effectively exhaust the blisters.   
     
     
         2 . The in-mold label of  claim 1 , wherein the substrate is a base layer made of a thermoplastic resin material. 
     
     
         3 . The in-mold label of  claim 1 , wherein the heat-sealable layer is made of a thermoplastic resin material. 
     
     
         4 . The in-mold label of  claim 3 , wherein the interlaced and continuous-arranged micro-protrusions are formed by the heating-embossing-cooling process using a roller with surface structure. 
     
     
         5 . The in-mold label of  claim 1 , wherein the in-mold label has a thickness of from 60 micrometer to 120 micrometer. 
     
     
         6 . The in-mold label of  claim 5 , wherein the in-mold label has a density of from 0.50 g/cm 3  to 1.05 g/cm 3 . 
     
     
         7 . The in-mold label of  claim 6 , wherein the micro-protrusions are formed by various interlaced and continuous-arranged holes. 
     
     
         8 . The in-mold label of  claim 7 , wherein the hole has a depth of from 8 micrometer to 14 micrometer. 
     
     
         9 . The in-mold label of  claim 8 , wherein spacing among the holes is from 10 micrometer to 1000 micrometer. 
     
     
         10 . The in-mold label of  claim 9 , wherein diameter of each micro-protrusion is from 1000 micrometer to 1600 micrometer.

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