Heat Spreader with Thermal Conductivity Inversely Proportional to Increasing Heat

Abstract

A heat spreading apparatus includes a body defining a void. A fluid is positioned within the void for distributing heat by vaporizing the fluid. The body defines a void with a heat accumulation surface geometry to disrupt the thermodynamic cycle of vaporizing the fluid and thereby diminish heat spreading activity by the heat spreading apparatus.

1 . A heat spreading apparatus, comprising:
 a body defining a void; and   a fluid positioned within the void for distributing heat by vaporizing the fluid;   wherein the body defines a void with a heat accumulation surface geometry to disrupt the thermodynamic cycle of vaporizing the fluid and thereby diminish heat spreading activity by the heat spreading apparatus.   
     
     
         2 . The heat spreading apparatus of  claim 1  wherein the heat accumulation surface geometry promotes bubble growth. 
     
     
         3 . The heat spreading apparatus of  claim 1  wherein the heat accumulation surface geometry promotes dry out. 
     
     
         4 . The heat spreading apparatus of  claim 1  wherein the heat accumulation surface geometry has indentations to promote bubble growth. 
     
     
         5 . The heat spreading apparatus of  claim 1  wherein the heat accumulation surface geometry includes a capillary wick structure. 
     
     
         6 . The heat spreading apparatus of  claim 1  wherein the heat accumulation surface geometry has a hydrophilic surface. 
     
     
         7 . The heat spreading apparatus of  claim 1  wherein the heat accumulation surface geometry has a hydrophobic surface. 
     
     
         8 . The heat spreading apparatus of  claim 1  wherein the body has additional thermal resistance promoting features.