US2014098266A1PendingUtilityA1

Systems and methods for controlling aliasing in images captured by an array camera for use in super resolution processing using pixel apertures

Assignee: PELICAN IMAGING CORPPriority: Sep 19, 2011Filed: Dec 10, 2013Published: Apr 10, 2014
Est. expirySep 19, 2031(~5.1 yrs left)· nominal 20-yr term from priority
H04N 25/41H04N 23/951H04N 23/45H04N 23/16H04N 13/271H04N 2013/0081H04N 13/232H04N 9/097
60
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Claims

Abstract

Imager arrays, array camera modules, and array cameras in accordance with embodiments of the invention utilize pixel apertures to control the amount of aliasing present in captured images of a scene. One embodiment includes a plurality of focal planes, control circuitry configured to control the capture of image information by the pixels within the focal planes, and sampling circuitry configured to convert pixel outputs into digital pixel data. In addition, the pixels in the plurality of focal planes include a pixel stack including a microlens and an active area, where light incident on the surface of the microlens is focused onto the active area by the microlens and the active area samples the incident light to capture image information, and the pixel stack defines a pixel area and includes a pixel aperture, where the size of the pixel apertures is smaller than the pixel area.

Claims

exact text as granted — not AI-modified
What is claimed: 
     
         1 . An imager array, comprising:
 a plurality of focal planes, where each focal plane comprises a two dimensional arrangement of pixels having at least two pixels in each dimension and each focal plane is contained within a region of the imager array that does not contain pixels from another focal plane;   control circuitry configured to control the capture of image information by the pixels within the focal planes; and   sampling circuitry configured to convert pixel outputs into digital pixel data;   wherein each of the pixels in the plurality of focal planes comprises a pixel stack including a microlens and an active area, where light incident on the surface of the microlens is focused onto the active area by the microlens and the active area samples the incident light to capture image information;   wherein the pixel stack of each pixel defines a pixel area and includes a pixel aperture, where the size of the pixel aperture is smaller than the pixel area.   
     
     
         2 . The imager array of  claim 1 , wherein the pixel aperture of each pixel stack is formed by a microlens that is smaller than the pixel area of the pixel. 
     
     
         3 . The imager array of  claim 2 , wherein gaps exist between adjacent microlenses in the pixel stacks of adjacent pixels in a focal plane. 
     
     
         4 . The imager array of  claim 3 , wherein light is prevented from entering the pixel stacks through the gaps between the microlenses by a light blocking material. 
     
     
         5 . The imager array of  claim 4 , wherein photoresist is located in the gaps between the microlenses. 
     
     
         6 . The imager array of  claim 2 , wherein the amount of aliasing in an image captured by a focal plane is greater than the amount of aliasing that would be present were the microlens to occupy the entire pixel area defined by the pixel stack. 
     
     
         7 . The imager array of  claim 2 , wherein the pixel stacks further comprise an oxide layer and the microlens sits atop the oxide layer. 
     
     
         8 . The imager array of  claim 7 , wherein the pixel stack includes a color filter. 
     
     
         9 . The imager array of  claim 8 , wherein the color filters in the pixel stacks of the two dimensional arrangement of pixels within a focal plane are the same. 
     
     
         10 . The imager array of  claim 8 , wherein the color filters in the pixel stacks of the two dimensional arrangement of pixels within at least one focal plane form a Bayer filter pattern. 
     
     
         11 . The imager array of  claim 7 , wherein the pixel stack does not include a color filter. 
     
     
         12 . The imager array of  claim 7 , wherein the pixel stack includes a nitride passivation layer and a bottom oxide layer that provides support and isolation for metal interconnects. 
     
     
         13 . The imager array of  claim 1 , wherein the pixel aperture is formed using at least one light blocking material. 
     
     
         14 . An imager array, comprising:
 a plurality of focal planes, where each focal plane comprises a two dimensional arrangement of pixels having at least two pixels in each dimension and each focal plane is contained within a region of the imager array that does not contain pixels from another focal plane;   control circuitry configured to control the capture of image information by the pixels within the focal planes; and   sampling circuitry configured to convert pixel outputs into digital pixel data;   wherein each of the pixels in the plurality of focal planes comprises a pixel stack including a microlens and an active area, where light incident on the surface of the microlens is focused onto the active area by the microlens and the active area samples the incident light to capture image information;   wherein the pixel stack of each pixel defines a pixel area and the microlens forms a pixel aperture, where the size of the pixel aperture is smaller than the pixel area;   wherein gaps exist between adjacent microlenses in the pixel stacks of adjacent pixels in a focal plane;   wherein the pixel stack further comprises light blocking material located to prevent light from entering the pixel stacks through the gaps between the microlenses; and   wherein the amount of aliasing in images captured by a focal plane is greater than the amount of aliasing that would be present were the microlens in each pixel stack to occupy the entire pixel area defined by the pixel stack.   
     
     
         15 . An array camera module, comprising:
 an imager array configured to capture light field image data, comprising:
 a plurality of focal planes, where each focal plane comprises a two dimensional arrangement of pixels having at least two pixels in each dimension and each focal plane is contained within a region of the imager array that does not contain pixels from another focal plane; 
 control circuitry configured to control the capture of image information by the pixels within the focal planes; and 
 sampling circuitry configured to convert pixel outputs into digital pixel data; 
 wherein each of the pixels in the plurality of focal planes comprise a pixel stack including a microlens and an active area, where light incident on the surface of the microlens is focused onto the active area by the microlens and the active area samples the incident light to capture image information; 
 wherein the pixel stack of each pixel defines a pixel area and includes a pixel aperture, where the size of the pixel apertures is smaller than the pixel area; and 
   an optic array of lens stacks, where an image including aliasing is formed on each focal plane by a separate lens stack in the optic array of lens stacks.   
     
     
         16 . The array camera module of  claim 15 , wherein the pixel aperture of each pixel stack is formed by a microlens that is smaller than the pixel area of the pixel. 
     
     
         17 . The array camera module of  claim 16 , wherein gaps exist between adjacent microlenses in the pixel stacks of adjacent pixels in a focal plane. 
     
     
         18 . The array camera module of  claim 17 , wherein light is prevented from entering the pixel stacks through the gaps between the microlenses by a light blocking material. 
     
     
         19 . The array camera module of  claim 18 , wherein photoresist is located in the gaps between the microlenses. 
     
     
         20 . The array camera module of  claim 16 , wherein the amount of aliasing in images captured by a focal plane is greater than the amount of aliasing that would be present were the microlens in each pixel stack to occupy the entire pixel area defined by the pixel stack. 
     
     
         21 . The array camera module of  claim 16 , wherein the pixel stacks further comprise an oxide layer and the microlens sits atop the oxide layer. 
     
     
         22 . The array camera module of  claim 21 , wherein the pixel stack includes a color filter. 
     
     
         23 . The array camera module of  claim 22 , wherein the color filters in the pixel stacks of the two dimensional arrangement of pixels within a focal plane are the same. 
     
     
         24 . The array camera module of  claim 22 , wherein the color filters in the pixel stacks of the two dimensional arrangement of pixels within at least one focal plane form a Bayer filter pattern. 
     
     
         25 . The array camera module of  claim 21 , wherein at least one of the plurality of lens stacks includes a color filter and the pixel stacks of the two dimensional arrangement of pixels within the focal plan on which said at least one of the plurality of lens stacks forms an image do not include color filters. 
     
     
         26 . The array camera module of  claim 21 , wherein the pixel stack includes a nitride passivation layer and a bottom oxide layer that provides support and isolation for metal interconnects. 
     
     
         27 . The array camera module of  claim 15 , wherein the pixel aperture is formed using at least one light blocking material. 
     
     
         28 . The array camera module of  claim 15 , wherein the lens stack array is constructed using wafer level optics. 
     
     
         29 . The array camera module of  claim 15 , wherein the plurality of lens stacks include polymer optical components. 
     
     
         30 . The array camera module of  claim 15 , wherein the plurality of lens stacks include glass optical components.

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