Grinding apparatus for a substrate

Abstract

A substrate grinding apparatus according to an exemplary embodiment of the present invention includes a grinding wheel grinding an object substrate, a nozzle unit spraying cooling water to the object substrate and the grinding wheel in a plurality of directions, and a cooling water controller connected to the nozzle unit and controlling spray speed and pressure of the cooling water, in which the nozzle unit includes a cleansing nozzle cleansing the grinding wheel, a cooling nozzle cooling the grinding wheel, and a surface protecting nozzle cooling the object substrate.

What is claimed is: 
     
         1 . A substrate grinding apparatus comprising:
 a grinding wheel configured to grind an object substrate;   a nozzle unit configured to spray cooling water to the object substrate and the grinding wheel in a plurality of directions; and   a cooling water controller connected to the nozzle unit and configured to control a spray speed and a pressure of the cooling water,   wherein the nozzle unit includes,
 a cleansing nozzle configured to cleanse the grinding wheel, 
 a cooling nozzle configured to cool the grinding wheel, and 
 a surface protecting nozzle configured to cool the object substrate. 
   
     
     
         2 . The substrate grinding apparatus of  claim 1 , wherein the cleansing nozzle is configured to spray the cooling water to the grinding wheel after the grinding wheel and the object substrate contact each other. 
     
     
         3 . The substrate grinding apparatus of  claim 2 , wherein the cleansing nozzle includes a two-fluid nozzle. 
     
     
         4 . The substrate grinding apparatus of  claim 1 , wherein the cooling nozzle is configured to spray the cooling water to the grinding wheel before the grinding wheel and the object substrate contact each other. 
     
     
         5 . The substrate grinding apparatus of  claim 1 , wherein the surface protecting nozzle is configured to spray the cooling water to the grinding wheel and the object substrate. 
     
     
         6 . The substrate grinding apparatus of  claim 1 , further comprising:
 a rotating unit connected to the nozzle unit and configured to change a cooling water spray direction of the nozzle unit; and   a numerical value controller connected to the rotating unit and configured to control the rotating unit.   
     
     
         7 . The substrate grinding apparatus of  claim 6 , wherein the rotating unit includes:
 a power transmission apparatus;   a rotation shaft configured to rotate the power transmission apparatus; and   a rotary joint connected to the power transmission apparatus.   
     
     
         8 . The substrate grinding apparatus of  claim 7 , wherein a supply flow path of the cooling water is formed at an outer ring of the rotary joint. 
     
     
         9 . The substrate grinding apparatus of  claim 8 , wherein the nozzle unit includes:
 a first nozzle controller connected to the surface protecting nozzle; and   a second nozzle controller connected to the cooling nozzle and the cleansing nozzle.   
     
     
         10 . The substrate grinding apparatus of  claim 9 , wherein the first nozzle controller and the second nozzle controller are connected to an outer ring of the rotary joint. 
     
     
         11 . The substrate grinding apparatus of  claim 10 , wherein the first nozzle controller and the second nozzle controller are moved up and down and rotated left and right. 
     
     
         12 . The substrate grinding apparatus of  claim 1 , further comprising an air layer removal film positioned near the grinding wheel and configured to remove an air boundary layer. 
     
     
         13 . A grinding apparatus comprising:
 a grinding unit configured to grind an object;   a rotating unit connected to the grinding unit and configured to rotate the grinding unit; and   a nozzle unit configured to spray a cooling material to the grinding unit or object in a plurality of directions.   
     
     
         14 . The grinding apparatus of  claim 13 , wherein the nozzle unit includes a first nozzle configured to spray the cooling material in a first direction and a second nozzle configured to spray the cooling material in a second direction different from the first direction. 
     
     
         15 . The grinding apparatus of  claim 14 , wherein the nozzle unit includes a third nozzle configured to spray the cooling material in a third direction different from the first and second directions. 
     
     
         16 . The grinding apparatus of  claim 13 , further comprising a cooling water controller connected to the nozzle unit and configured to control a speed and a pressure of the sprayed cooling material. 
     
     
         17 . The grinding apparatus of  claim 13 , wherein the nozzle unit is connected to an outer ring of the rotating unit.