US2014103782A1PendingUtilityA1

Ultrasonic transducer and fabricating the same

49
Assignee: TOSHIBA KKPriority: Jun 23, 2010Filed: Dec 20, 2013Published: Apr 17, 2014
Est. expiryJun 23, 2030(~3.9 yrs left)· nominal 20-yr term from priority
Y10T29/49005Y10T29/42H10N 30/01B06B 1/0622G10K 9/125H01L 41/22
49
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Claims

Abstract

An aspect of one embodiment, there is provided an ultrasonic transducer including a plurality of oscillators, each of the oscillator having a convex portion, a printed wiring board provided to be opposed to the convex portion and electrically connected to the convex portion, a resin provided between the oscillator and the printed wiring board, the resin covering at least the convex portion and a portion of the printed wiring board.

Claims

exact text as granted — not AI-modified
1 . (canceled) 
     
     
         2 . An ultrasonic transducer, comprising:
 a plurality of oscillators, each of the oscillator having a convex portion;   a printed wiring board provided to be opposed to the convex portion and electrically connected to the convex portion;   a resin provided between the oscillator and the printed wiring board, the resin covering at least the convex portion and a portion of the printed wiring board.   
     
     
         3 . The ultrasonic transducer of  claim 2 , wherein
 the oscillator includes a transducer element including an acoustic matching layer, a piezoelectric element and a backing member in order as a stacked body, a first electrode on the packing member and a second electrode on the acoustic matching layer, and the convex portion includes the first electrode and the backing member.   
     
     
         4 . The ultrasonic transducer of  claim 2 , wherein
 the oscillator includes the transducer element including the acoustic matching layer, the piezoelectric element and the backing member in order as the stacked body, the first electrode on the backing member and the second electrode on the acoustic matching layer, and the convex portion is provided on the first electrode.   
     
     
         5 . The ultrasonic transducer of  claim 2 , further comprising:
 an adhesive material contacted to cover at least a portion of the convex portion, the adhesive material connecting the oscillator and the printed wiring board,   wherein the resin is provided to cover at least a portion of the adhesive material.   
     
     
         6 . A method of fabricating the ultrasonic transducer according to  claim 2 , comprising:
 providing the plurality of the convex portions on a oscillation body;   aligning to electrically connect each of the convex portions with the printed wiring board;   providing a resin between the oscillation body and the printed wiring board; and   dividing the oscillation body into the plurality of oscillators.   
     
     
         7 . The method of  claim 6 , wherein
 the resin covers at least each of the convex portions and a portion of the printed wiring board in the providing of the resin.   
     
     
         8 . The method of  claim 6 , wherein
 the oscillation body includes an acoustic matching layer, a piezoelectric element and a backing member in order as the stacked body, and a first electrode is provided on the backing member and the second electrode is provided on the acoustic matching layer, and the backing member is diced in the providing of the convex portion.   
     
     
         9 . The method of  claim 6 , wherein
 the oscillation body includes the acoustic matching layer, the piezoelectric element and the backing member in order as the stacked body, and the first electrode is provided on the backing member and the second electrode is provided on the acoustic matching layer, and a conductive bump is formed on the first electrode in the providing of the convex portion.   
     
     
         10 . The method of  claim 6 , further comprising:
 providing an adhesive material at a position on which the convex portion is provided on the printed wiring board.   
     
     
         11 . The method of  claim 6 , wherein
 dicing a portion of the resin between the oscillation body and the printed wiring board in the dividing of the oscillation body.

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