Printed circuit board and method of manufacturing the same

Abstract

Disclosed herein is a method of manufacturing a printed circuit board, including the steps of providing a substrate including a first metal layer formed thereon, and forming a patterned first insulation layer on the first metal layer. The method further includes patterning the first metal layer to allow the first metal layer to have a pattern corresponding to that of the first insulation layer, thus forming a first circuit layer, and forming a second insulation layer on the substrate such that the second insulation layer surrounds the first circuit layer and the first insulation layer formed on the first circuit layer. The printed circuit board is advantageous in that process time and process cost can be reduced because a first insulation layer is used as an etching resist and is included as a part of a printed circuit board even after etching.

What is claimed is: 
     
         1 . A method of manufacturing a printed circuit board, comprising:
 providing a substrate including a first metal layer formed thereon;   forming a patterned first insulation layer on the first metal layer;   patterning the first metal layer to allow the first metal layer to have a pattern corresponding to that of the first insulation layer, thus forming a first circuit layer; and   forming a second insulation layer on the substrate such that the second insulation layer surrounds the first circuit layer and the first insulation layer formed on the first circuit layer.   
     
     
         2 . The method according to  claim 1 , further comprising:
 after the providing of the substrate including the first metal layer formed thereon, black oxidizing the first metal layer.   
     
     
         3 . The method according to  claim 1 , wherein the forming of the patterned first insulation layer comprises:
 printing the patterned first insulation layer on the first metal layer; and   curing the first insulation layer.   
     
     
         4 . The method according to  claim 1 , wherein, in the forming of the first circuit layer, the first circuit layer having a pattern corresponding to that of the first insulation layer is formed by etching the first metal layer using the first insulation layer as an etching resist.