Heat dissipating protective cover
Abstract
A heat dissipating protective cover for electronic devices includes a bottom plate, a protective edge disposed around the periphery of the bottom plate, a containing space defined by an enclosure jointly formed by the bottom plate and the protective edge for containing an electronic device, and a heat dissipating plate installed in the bottom plate, so that the heat generated by the electronic device installed with the protective cover is dissipated through the heat dissipating plate to the outside to achieve a good heat dissipation effect during the operation of the electronic device without the need of removing the protective cover and assure the service life of the electronic device. Meanwhile, the electronic device can be operated without removing the protective cover, so that the protective cover will not be lost easily, and this design can eliminate the trouble and inconvenience of the users.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A heat dissipating protective cover, comprising:
a bottom plate, a protective edge disposed around the periphery of the bottom plate, a containing space defined by an enclosure jointly formed by the bottom plate and the protective edge and provided for containing an electronic device, and a heat dissipating plate installed in the bottom plate.
2 . The heat dissipating protective cover of claim 1 , wherein the protective edge is an elastic structure.
3 . The heat dissipating protective cover of claim 1 , wherein the bottom plate has a cooling groove formed thereon and at a position corresponding to the heat dissipating plate and provided for coupling the heat dissipating plate.
4 . The heat dissipating protective cover of claim 3 , wherein the heat dissipating plate is adhered into the cooling groove.
5 . The heat dissipating protective cover of claim 1 , wherein the protective edge has an opening formed thereon.
6 . The heat dissipating protective cover of claims 1 , wherein the protective edge has a free end inwardly bent to form a snap portion for securing the electronic device.
7 . The heat dissipating protective cover of claims 2 , wherein the protective edge has a free end inwardly bent to form a snap portion for securing the electronic device.
8 . The heat dissipating protective cover of claims 3 , wherein the protective edge has a free end inwardly bent to form a snap portion for securing the electronic device.
9 . The heat dissipating protective cover of claims 4 , wherein the protective edge has a free end inwardly bent to form a snap portion for securing the electronic device.
10 . The heat dissipating protective cover of claims 5 , wherein the protective edge has a free end inwardly bent to form a snap portion for securing the electronic device.
11 . The heat dissipating protective cover of claim 1 , wherein the protective edge is a plastic protective edge.
12 . The heat dissipating protective cover of claim 1 , wherein the bottom plate is a metal bottom plate or a thermally conductive plastic body.
13 . The heat dissipating protective cover of claim 1 , wherein the heat dissipating plate has a thin film disposed on a surface of the heat dissipating plate.
14 . The heat dissipating protective cover of claim 3 , wherein the heat dissipating plate has a thin film disposed on a surface of the heat dissipating plate.
15 . The heat dissipating protective cover of claim 14 , wherein the thin film is a metal thin film.Join the waitlist — get patent alerts
Track US2014110083A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.