Mobile communicator with curved sensor camera

Abstract

Methods and apparatus for combining a mobile communication device having a camera ( 150 ) that includes a curved sensor ( 160 ) are disclosed. The present invention offers higher quality pictures that conventional phones that incorporate a flat sensor. These higher quality pictures are obtained without the need for large, bulky and expensive lenses. Higher light gathering capacity is provided, which reduces or eliminates the need for a flash to enhance ambient illumination. Longer battery life is obtained, since the need for a flash is reduced or eliminated. The combination of a mobile communication device with a camera that utilizes a curved sensor renders dedicated pocket cameras obsolete. The present invention, which, for the first time, combines a mobile communication device with a high performance camera, will reduce or eliminate the need to carry a separate stand-alone camera.

What is claimed is: 
     
         1 . An apparatus comprising:
 a mobile communication means for providing communication capabilities;   said mobile communication means including an enclosure;   said enclosure including   an objective lens;   said objective lens being mounted on said enclosure;   said objective lens for collecting a stream of radiation; and   a curved sensor;   said curved sensor including a plurality of planar facets;   said curved sensor being mounted inside said enclosure;   said curved sensor being aligned with said objective lens;   said curved sensor having a portion which extends beyond a generally two-dimensional plane;   said curved sensor having an output for recording an image.   
     
     
         2 . An apparatus as recited in  claim 1 , in which:
 said curved sensor generally includes a plurality of segments.   
     
     
         3 . An apparatus as recited in  claim 2 , in which:
 said plurality of segments are disposed to approximate a curved surface.   
     
     
         4 . An apparatus as recited in  claim 1 , in which:
 said curved sensor has a two dimensional profile which is not completely colinear with a straight line.   
     
     
         5 . An apparatus as recited in  claim 1 , in which:
 said curved sensor is fabricated from ultra-thin silicon.   
     
     
         6 . An apparatus as recited in  claim 5 , in which said ultra-thin silicon ranges from 50 to 250 microns in one dimension. 
     
     
         7 . An apparatus as recited in  claim 1 , in which:
 said curved sensor is fabricated from polysilicon.   
     
     
         8 . An apparatus as recited in  claim 1 , in which:
 said curved sensor includes a plurality of radial segments.   
     
     
         9 . An apparatus as recited in  claim 1 , in which:
 said curved sensor is formed as a plurality of polygons.   
     
     
         10 . An apparatus as recited in  claim 1 , in which:
 said plurality of pixels are arranged on said curved sensor in varying density.   
     
     
         11 . An apparatus as recited in  claim 1 , in which:
 said curved sensor is configured to have a relatively higher concentration of pixels generally near the center of said curved sensor.   
     
     
         12 . An apparatus as recited in  claim 1 , in which:
 said curved sensor is configured to have a relatively lower concentration of pixels generally near an edge of said curved sensor.   
     
     
         13 . An apparatus as recited in  claim 12 , in which:
 said relatively high concentration of pixels generally near the center of said curved sensor enables zooming into a telephoto shot using said relatively high concentration of pixels generally near the center of said curved sensor only, while retaining relatively high image resolution.   
     
     
         14 . An apparatus as recited in  claim 1 , further including:
 a shade; said shade being disposed to generally to move to block incoming light;   said shade being retracted so that it does not block incoming light when a wide angle image is sensed;   said shade being extended to block incoming extraneous light from non-image areas when a telephoto image is sensed.   
     
     
         15 . An apparatus as recited in  claim 1 , in which:
 said camera enclosure being sealed;   said camera enclosure being injected with an inert gas during assembly.   
     
     
         16 . An apparatus as recited in  claim 15 , in which said inert gas is selected from the group consisting of Argon, Krypton or Xenon. 
     
     
         17 . An apparatus as recited in  claim 1 , in which:
 said objective lens is a radically high speed lens, and enables the use of said mobile communication means for surveillance without flash.   
     
     
         18 . An apparatus as recited in  claim 1 , in which:
 said objective lens is a radically high speed lens, and enables the use of said mobile communication means for fast action photography.   
     
     
         19 . An apparatus as recited in  claim 1 , in which:
 said curved sensor is connected to a spiral-shaped electrical connector.   
     
     
         20 . An apparatus as recited in  claim 1 , in which:
 said curved sensor is connected to an according-shaped electrical connector.   
     
     
         21 . An apparatus as recited in  claim 1 , in which:
 said curved sensor is connected to a generally radially extending electrical connector.   
     
     
         22 . An apparatus as recited in  claim 1 , further comprising:
 a transmitter; said transmitter being connected to said curved sensor; and   a receiver; said receiver being connected to a signal processor.   
     
     
         23 . An apparatus as recited in  claim 2 , in which:
 said plurality of segments forms a gap between each of said plurality of segments; and   said gap is used as a pathway for an electrical connector.   
     
     
         24 . A method comprising the steps of:
 providing a mobile communication means for providing communication capabilities;   said mobile communication means including an enclosure;   said enclosure including   an objective lens;   said objective lens being mounted on said enclosure;   said objective lens for collecting a stream of radiation; and   fabricating a curved sensor;   said curved sensor including a plurality of planar facets;   said curved sensor being mounted inside said enclosure;   said curved sensor being aligned with said objective lens;   said curved sensor having a portion which extends beyond a generally two-dimensional plane;   generating an image using the output of said curved sensor;   creating a concave mold to shape silicon after heating a wafer to a nearly molten state; and   allowing gravity to settle said silicon into said concave mold to form said curved sensor.   
     
     
         25 . A method as recited in  claim 24 , further comprising the step of:
 chilling said concave mold to maintain the original thickness uniformly by reducing the temperature quickly.   
     
     
         26 . A method as recited in  claim 24 , further comprising the step of:
 using a centrifuge to complete the fabrication of said curved sensor.   
     
     
         27 . A method as recited in  claim 24 , further comprising the step of:
 using air pressure relieved by porosity in said concave mold to complete the fabrication of said curved sensor.   
     
     
         28 . A method as recited in  claim 24 , further comprising the step of:
 using steam to complete the fabrication of said curved sensor.   
     
     
         29 . A method as recited in  claim 24 , further comprising the step of:
 pressing a convex mold onto said wafer; and   forcing said wafer into said concave mold after raising the temperature.   
     
     
         30 . A method as recited in  claim 24 , further comprising the step of:
 machining said wafer to complete the fabrication of said curved sensor.   
     
     
         31 . A method as recited in  claim 24 , further comprising the step of:
 polishing said wafer to complete the fabrication of said curved sensor.   
     
     
         32 . A method as recited in  claim 24 , further comprising the step of:
 laser etching excess material on said wafer to complete the fabrication of said curved sensor.   
     
     
         33 . A method as recited in  claim 24 , further comprising the steps of:
 forming the base of said curved sensor by first providing a dome-shaped first mandrel on a substrate;   impressing a thin sheet of heated deformable material over said first mandrel;   placing a second sheet of heated, deformable material over a second mandrel;   applying a vacuum pressure to draw said second sheet of heated, deformable material downward;   heating said second mandrel; and   forming sensor pixels on said curved sensor.