US2014117574A1PendingUtilityA1

Strain and Kinetics Control During Separation Phase of Imprint Process

Assignee: KHUSNATDINOV NIYAZPriority: Oct 24, 2008Filed: Jan 8, 2014Published: May 1, 2014
Est. expiryOct 24, 2028(~2.2 yrs left)· nominal 20-yr term from priority
B82Y 10/00B29C 37/0003G03F 7/0002B82Y 40/00
59
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

Systems and methods for improving robust layer separation during the separation process of an imprint lithography process are described. Included are methods of matching strains between a substrate to be imprinted and the template, varying or modifying the forces applied to the template and/or the substrate during separation, or varying or modifying the kinetics of the separation process.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method of separating an imprint lithography template from a solidified patterned layer formed on a substrate, the method comprising:
 applying, by a chuck connected to the template, pressure to the template;   applying, by an imprint head connected to the chuck; a force normal to the solidified layer to initiate separation of the template from the solidified layer;   controlling the force applied by the imprint head and pressure applied by the chuck, wherein such controlling limits lateral displacement of the template with respect to the substrate.   
     
     
         2 . The method of  claim 1  further comprising applying a predetermined pressure to the template prior to initiating separation. 
     
     
         3 . The method of  claim 1  further comprising applying partial vacuum pressure to the template. 
     
     
         4 . The method of  claim 1  wherein shearing stress on patterned layer features is minimized during separation.

Join the waitlist — get patent alerts

Track US2014117574A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.