Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization

Abstract

A method of rendering a substrate catalytic to electroless metal deposition comprising the steps of: (a) depositing a ligating chemical agent on the substrate, which is capable of both binding to the substrate and ligating to an electroless plating catalyst; and (b) ligating the electroless plating catalyst to the ligating chemical agent, wherein the ligating chemical agent has the chemical structure: wherein n and m are each between about 1 and about 100.

What is claimed is: 
     
         1 . A method of rendering a substrate catalytic to electroless metal deposition comprising the steps of: (a) depositing a ligating chemical agent on said substrate, which is capable of both binding to said substrate and ligating to an electroless plating catalyst; and (b) ligating said electroless plating catalyst to said ligating chemical agent,
 wherein said ligating chemical agent has the chemical structure:   
       
         
           
           
               
               
           
         
         wherein n and m are each between about 1 and about 100. 
       
     
     
         2 . The method of  claim 1 , wherein n and m are each between about 10 and about 20. 
     
     
         3 . The method of  claim 1 , wherein said ligating chemical agent has a n:m ratio between about 50:1 to about 1:50. 
     
     
         4 . The method of  claim 1 , further comprising, after step (a), the step of contacting said substrate with a chemical reagent capable of reacting with at least one functional group of said ligating chemical agent. 
     
     
         5 . The method of  claim 1 , wherein said substrate is selected from the group consisting of: silicon oxide, titanium oxide, zirconium oxide, indium tin oxide, indium zinc oxide, tin oxide, zinc oxide, copper oxide, aluminum oxide, nickel oxide, and combinations thereof. 
     
     
         6 . The method of  claim 1 , wherein said substrate comprises a polymer with surface hydroxyl groups. 
     
     
         7 . The method of  claim 1 , wherein said electroless plating catalyst is a palladium catalyst. 
     
     
         8 . The method of  claim 1 , wherein said electroless plating catalyst is a palladium-tin colloid. 
     
     
         9 . The method of  claim 1 , wherein said electroless plating catalyst is selected to deposit metals from the group consisting of: cobalt, nickel, copper, gold, platinum, palladium, silver, and alloys thereof. 
     
     
         10 . A method of rendering a substrate catalytic to electroless metal deposition comprising the steps of: (a) depositing a ligating chemical agent on said substrate, which is capable of both binding to said substrate and ligating to an electroless plating catalyst; and (b) ligating said electroless plating catalyst to said ligating chemical agent,
 wherein said ligating chemical agent has the chemical structure:   
       
         
           
           
               
               
           
         
         wherein n and m are each between about 1 and about 100. 
       
     
     
         11 . The method of  claim 10 , wherein n and m are each between about 10 and about 20. 
     
     
         12 . The method of  claim 10 , wherein said ligating chemical agent has a n:m ratio between about 50:1 to about 1:50. 
     
     
         13 . The method of  claim 10 , further comprising, after step (a), the step of contacting said substrate with a chemical reagent capable of reacting with at least one functional group of said ligating chemical agent. 
     
     
         14 . The method of  claim 10 , wherein said substrate is selected from the group consisting of: silicon oxide, titanium oxide, zirconium oxide, indium tin oxide, indium zinc oxide, tin oxide, zinc oxide, copper oxide, aluminum oxide, nickel oxide, and combinations thereof. 
     
     
         15 . The method of  claim 10 , wherein said substrate comprises a polymer with surface hydroxyl groups. 
     
     
         16 . The method of  claim 10 , wherein said electroless plating catalyst is a palladium catalyst. 
     
     
         17 . The method of  claim 10 , wherein said electroless plating catalyst is a palladium-tin colloid. 
     
     
         18 . The method of  claim 10 , wherein said electroless plating catalyst is selected to deposit metals from the group consisting of: cobalt, nickel, copper, gold, platinum, palladium, silver, and alloys thereof.