US2014131013A1PendingUtilityA1
Low-profile heat pipe
Est. expiryNov 15, 2032(~6.3 yrs left)· nominal 20-yr term from priority
Inventors:Chin-Hsing Horng
F28D 15/046F28D 15/0233F28D 15/02
55
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Claims
Abstract
A low-profile heat pipe includes a flat plate-like first pipe component shaped like a flat plat member and having a wick structure sintered to the inner surface thereof, a flat plate-like second pipe component having a wick structure sintered to the inner surface thereof, an enclosed cavity defined in between the first pipe component and the second pipe component and surrounded by the wick structures of the first and second pipe components, and a working fluid contained in the enclosed cavity.
Claims
exact text as granted — not AI-modifiedWhat the invention claimed is:
1 . A low-profile heat pipe, comprising:
a first pipe component shaped like a flat plat member; a second pipe component shaped like a flat plate member and covered on and bonded to said first pipe component, said second pipe component comprising a wick structure formed on an inner surface thereof by sintering; an enclosed cavity defined in between said first pipe component and said second pipe component and partially surrounded by the wick structure of said second pipe component; and a working fluid contained in said enclosed cavity.
2 . The low-profile heat pipe as claimed in claim 1 , wherein said first pipe component comprises at least one first curved potion disposed between two opposite ends thereof; said second pipe component comprises at least one second curved portion disposed between two opposite ends thereof corresponding to said at least one first curved portion of said first pipe component.
3 . The low-profile heat pipe as claimed in claim 1 , wherein said first pipe component comprises a wick structure formed on an inner surface thereof by sintering and abutted against the wick structure of said second pipe component around said enclosed cavity.
4 . The low-profile heat pipe as claimed in claim 1 , wherein said first pipe component comprises a base wall, and an endless upright wall perpendicularly extended around the border of said base wall; said second pipe component is bonded to said endless upright wall of said first pipe component.
5 . The low-profile heat pipe as claimed in claim 1 , wherein said first pipe component comprises a base wall, an endless upright wall perpendicularly extended around the border of said base wall, and an inner locating groove located on an inner surface of said endless upright wall at a top side; said second pipe component is press-fitted into said inner locating groove of said endless upright all of said first pipe component in a flush manner.
6 . The low-profile heat pipe as claimed in claim 1 , wherein said first pipe component comprises a base wall, an endless upright wall perpendicularly extended around the border of the base wall thereof, and an outer locating groove located on an outer surface of said endless upright wall at a top side; said second pipe component comprises a base wall and an endless flange perpendicularly downwardly extended around the border of the base wall thereof and press-fitted into said outer locating groove of said endless upright wall of said first pipe component.Join the waitlist — get patent alerts
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