Treatment of Plastic Surfaces After Etching in Nitric Acid Containing Media

Abstract

A process for plating metal on plastic substrates, particularly ABS substrates, without the use of chrome containing etchants is disclosed. The process involves (i) etching the plastic substrate in an acidic solution of nitrate ions, and preferably silver ions, (ii) conditioning the substrate in an aqueous solution containing an amine or ammonia, (iii) activating the substrate, preferably with a palladium activator, and (iv) plating the substrate with an electroless plating solution. The process allows for complete adherent electroless plating of plastic substrates, particularly ABS substrates, without the use of chromic etchants.

1 . A method of treating a plastic substrate to accept electroless plating thereon, the method comprising the steps of:
 a) etching a surface of the plastic substrate by contacting the plastic substrate with an acidic solution containing nitrate ions;   b) contacting the etched plastic substrate with a conditioning solution comprising an aqueous solution comprising a quaternary amine;   c) activating the plastic substrate; and   d) contacting the activated plastic substrate with an electroless metal plating solution to deposit metal thereon.   
     
     
         2 . The method according to  claim 1 , wherein the acidic solution comprises oxidizing metal ions, wherein the oxidizing metal ions are selected from the group consisting of silver, manganese, cobalt, cerium and combinations thereof. 
     
     
         3 . The method according to  claim 2 , wherein the acidic solution comprises silver nitrate and nitric acid. 
     
     
         4 . The method according to  claim 3 , wherein the acidic solution comprises a wetting agent. 
     
     
         5 . The method according to  claim 1 , comprising the step of immersing the plastic substrate into an acid rinse after step (b) and before step (c). 
     
     
         6 . (canceled) 
     
     
         7 . (canceled) 
     
     
         8 . (canceled) 
     
     
         9 . (canceled) 
     
     
         10 . (canceled) 
     
     
         11 . (canceled) 
     
     
         12 . (canceled) 
     
     
         13 . (canceled) 
     
     
         14 . The method according to  claim 1 , wherein the quaternary amine comprises a polymeric quaternary amine having the general formula: 
       
         
           
           
               
               
           
         
         wherein: 
         R 1 , R 2 , R 3  and R 4  independently can be the same or different and may be selected from —CH 3 , —CH 2 CH 3 , —CH(CH 3 ) 2  or —CH 2 CH 2 OH; 
         R 5  is —CH 2 CH 2 —, —CH 2 CH 2 CH 2 —, —CH 2 CH 2 CH 2 CH 2 —, —CH 2 CHOHCH 2 — or —CH 2 CH 2 OCH 2 CH 2 ; 
         X and Y can be the same or different and are selected from Cl, Br, and I; 
         v and u can be the same or different and each can be 1 to 7; and 
         n is 2 to about 200. 
       
     
     
         15 . The method according to  claim 14 , wherein in the polymeric quaternary amine,
 R 1 , R 2 , R 3  and R 4  are each CH 3 ;   R 5  is —CH 2 CH 2 OCH 2 CH 2 ;   v and u are 3;   X and Y are Cl; and   n is an average of about 6.   
     
     
         16 . The method according to  claim 1  wherein the concentration of the amine and/or the ammonia in the conditioning solution is between about 5 and about 100 g/L. 
     
     
         17 . The method according to  claim 16 , wherein the concentration of the amine in the conditioning solution is between about 10 and about 50 g/L. 
     
     
         18 . The method according to  claim 1 , wherein the conditioning solution has a pH of between about 0 to about 14. 
     
     
         19 . The method according to  claim 18 , wherein the conditioning solution has a pH of between about 6 and about 12. 
     
     
         20 . The method according to  claim 1 , wherein the step of activating the etched and conditioned plastic substrate comprises contacting the plastic substrate with an activation solution comprising palladium. 
     
     
         21 . The method according to  claim 1 , further comprising the step of contacting the activated plastic substrate with an acid treatment prior to step (d). 
     
     
         22 . The method according to  claim 1 , wherein the electroless metal plating solution comprises electroless nickel. 
     
     
         23 . The method according to  claim 1 , wherein the plastic substrate comprises an acrylonitrile/butadiene/styrene copolymer or an acrylonitrile/butadiene/styrene copolymer blended with polycarbonate. 
     
     
         24 . The method according to  claim 2 , wherein the oxidizing metal ions are produced by electrochemical oxidation. 
     
     
         25 . The method according to  claim 24 , wherein the oxidizing metal ions comprise Ag 2+ .