Polishing pad

Abstract

A polishing pad includes at least a polishing layer including a groove, on a polishing surface, having side surfaces, wherein at least one of the side surfaces includes a first side surface that extends continuously to the polishing surface and forms an angle α with the polishing surface, and a second side surface that extends continuously to the first side surface and forms an angle β with a plane parallel to the polishing surface, the angle α is larger than 95 degrees, the angle β is larger than 95 degrees, and the angle β is smaller than the angle α, and a bending point depth from the polishing surface to a bending point between the first side surface and the second side surface is more than 0.2 mm and not more than 3.0 mm.

1 . A polishing pad comprising at least a polishing layer, wherein
 the polishing layer comprises a groove on a polishing surface, the groove having side surfaces,   at least one of the side surfaces comprises a first side surface that extends continuously to the polishing surface and forms an angle α with the polishing surface, and a second side surface that extends continuously to the first side surface and forms an angle β with a plane parallel to the polishing surface,   the angle α formed with the polishing surface is larger than 95 degrees, the angle β formed with the plane parallel to the polishing surface is larger than 95 degrees, and the angle β formed with the plane parallel to the polishing surface is smaller than the angle α formed with the polishing surface, and   a bending point depth from the polishing surface to a bending point between the first side surface and the second side surface is more than 0.2 mm and not more than 3.0 mm.   
     
     
         2 . The polishing pad according to  claim 1 , wherein a difference between the angle α formed with the polishing surface and the angle β formed with the plane parallel to the polishing surface is not larger than 55 degrees. 
     
     
         3 . The polishing pad according to  claim 1 , wherein the angle α formed with the polishing surface is not smaller than 105 degrees and not larger than 150 degrees. 
     
     
         4 . The polishing pad according to  claim 1 , wherein the angle β formed with the plane parallel to the polishing surface is larger than 95 degrees and smaller than 150 degrees. 
     
     
         5 . The polishing pad according to  claim 1 , wherein a groove pattern on the polishing surface is grid-shaped.