Thermally inkjettable acrylic dielectric ink formulation and process

Abstract

An aqueous composition for forming a micro-fluid jet printable dielectric film layer, methods for forming dielectric film layers, and dielectric film layers formed by the method. The aqueous composition includes from about 5 to about 20 percent by 65 weight of a polymeric binder emulsion, from about 10 to about 30 percent by weight of a humectant, from about 0 to about 3 percent by weight of a surfactant, and an aqueous carrier fluid. The aqueous composition has a viscosity ranging from about 2 to about 6 centipoise at a temperature of about 23° C.

What is claimed: 
     
         1 . A dielectric layer comprising one or more cured layers derived from an aqueous composition comprising:
 from about 5 to about 20 percent by weight of a polymeric hinder emulsion;   from about 5 to about 30 percent by weight of a humectant;   from about 0 to about 3 percent by weight of a surfactant; and   an aqueous carrier fluid,   wherein the aqueous composition has a viscosity ranging from about 2 to about 6 centipoise at a temperature of about 23° C.   
     
     
         2 . A method of forming a dielectric layer, the method comprising the steps of:
 micro-fluid jet printing onto a substrate an aqueous film forming composition comprising:   from about 5 to about 20 percent by weight of a dispersion of a polymeric binder emulsion;   from about 10 to about 30 percent by weight of a humectant;   from about 0 to about 3 percent by weight of a surfactant; and   an aqueous carrier fluid to provide a dielectric film layer, wherein the aqueous composition has a viscosity ranging from about 2 to about 6 centipoise at a temperature of about 23° C.;   and curing the dielectric film layer on the substrate to provide the dielectric layer.   
     
     
         3 . The method of  claim 2 , wherein the film layer made with the aqueous composition has a glass transition temperature ranging from about 40.degree. to about 110° C. 
     
     
         4 . The method of  claim 2 , wherein the humectant comprises a compound selected from the group consisting of dipropylene glycol, tripropylene glycol, triethylene glycol, tetraethylene glycol, 1-(2-hydroxyethyl)-2-pyrrolidone, trimethyolpropane, 1,2-propanediol, 1,3-propanediol, 1,5-pentanediol, 2-pyrrolidone, polyethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, 2,2-thiodiethanol, and mixtures thereof. 
     
     
         5 . The method of  claim 2 , wherein the surfactant comprises at least one non-ionic surfactant selected from the group consisting of alkylaryl polyether alcohol nonionic surfactants, alkylamine ethoxylates nonionic surfactants, ethoxylated acetylenic diols, polyalkylene and polyalkylene modified surfactants, polydimethylsiloxane copolymers alcohol alkoxylates nonionic surfactants, sorbitan ester products, alkoxylated esters/polyethylene glycol surfactants, unsaturated alcohol surfactants, alkyl phosphoric acid ester surfactants, alkyl amine oxide surfactants, anionic sarcosinate surfactants, glycerol esters or polyglycol ester nonionic surfactants, polyethylene glycol ether surfactants, modified poly-dimethyl-silicone surfactants, and the like. 
     
     
         6 . The method of  claim 2 , wherein the polymeric binder emulsion is selected from the group consisting of polyacrylate binder emulsions, epoxy binder emulsions, shellac binder emulsions, and isocyanate binder emulsions. 
     
     
         7 . The method of  claim 2 , wherein the dielectric layer has a thickness ranging from about 10 to about 40 microns. 
     
     
         8 . The method of  claim 2 , wherein the dielectric film layer is cured with heat to raise the temperature of the film layer to above a glass transition temperature and below a decomposition temperature for the film layer. 
     
     
         9 . The method of  claim 2 , wherein the substrate comprises a fluid composition receiving layer onto which the film forming composition is printed. 
     
     
         10 . The method of  claim 2  wherein the micro-fluid jet printing and curing steps were repeated from about 2 to about 20 times to provide the dielectric layer, further comprising curing the dielectric layer with a final cure step. 
     
     
         11 . A dielectric layer formed by the method of  claim 10 . 
     
     
         12 . A method for reducing silver migration between adjacent silver layers comprising disposing the dielectric layer of  claim 11  between the adjacent silver layers. 
     
     
         13 . A method for reducing silver migration between adjacent silver layers comprising encapsulating adjacent silver layers in one or more dielectric layers made according to  claim 2 .