Thermal management system with variable-volume material

Abstract

A thermal management system configured to be installed between a heat source and a heat sink, including a first heat conductor and a second heat conductor, a thermal switch configured to allow or prevent thermal connection between the first and second heat conductors, the thermal switch including at least one thermally conductive material that can connect the first and second conductors by a change in its volume, and the thermal switch including a controller configured to transfer thermal energy to the phase-change material to change a connection state. The connection is made when the heat source goes above a critical temperature, since the connection enables a heat flux to be established between the heat source and the heat sink.

1 - 28 . (canceled) 
     
     
         29 . A thermal management system configured to be installed between at least one heat source and at least one heat sink, comprising:
 a first heat conductor and a second heat conductor;   a thermal switch configured to allow or prevent thermal connection between the first and second heat conductors,   the thermal switch including at least one thermally conductive material, a volume of which varies according to a thermal energy input, the material configured to connect the first and second conductor by a change in its volume, and   the thermal switch including a controller configured to provide thermal energy to the material to change a connection state.   
     
     
         30 . A thermal management system according to  claim 29 , comprising at least three heat conductors, the switch being configured to put the at least three heat conductors into thermal connection with one another. 
     
     
         31 . A thermal management system according to  claim 29 , distributed in plural planes. 
     
     
         32 . A thermal management system according to  claim 29 , in which the controller is formed by the first conductor, the first conductor being in permanent contact with the material, and is configured to be connected to the at least one heat source. 
     
     
         33 . A thermal management system according to  claim 29 , in which the controller includes an additional heat conductor, the first and the second conductors not being in contact with the material in an unconnected state. 
     
     
         34 . A thermal management system according to  claim 29 , in which the controller is formed directly by an external environment, and the thermal energy is provided to the material by convection. 
     
     
         35 . A thermal management system according to  claim 29 , in which the first and second conductors have ends configured to be in contact with the material, the end of the first and/or second conductor being shaped to provide gradual contact between the end and the material when the volume of the material changes. 
     
     
         36 . A thermal management system according to  claim 29 , configured to facilitate return of the material to a predetermined area in which the first and second conductors are thermally unconnected in a disconnection area. 
     
     
         37 . A thermal management system according to  claim 29 , further comprising a substrate in or on which the heat conductors are formed, and in which the switch comprises a cavity formed in the substrate and containing the material, the heat conductors penetrating into the cavity. 
     
     
         38 . A thermal management system according to  claim 37 , in which the cavity comprises at least one inclined side wall facilitating return of the material into a disconnection area. 
     
     
         39 . A thermal management system according to  claim 37 , in which the cavity has a flared shape. 
     
     
         40 . A thermal management system according to  claim 37 , in which the two heat conductors are formed on the surface of the substrate, the end of the first conductor penetrating into the cavity more deeply than the end of the second conductor, and in which the material is in contact only with the end of the first conductor in an unconnected state. 
     
     
         41 . A thermal management system according to  claim 37 , in which the first conductor is formed in the substrate and its end emerges in a base of the cavity and the second conductor is formed on the substrate. 
     
     
         42 . A thermal management system according to  claim 37 , in which the cavity is closed in a sealed fashion by a cover. 
     
     
         43 . A thermal management system according to  claim 29 , in which the variable volume material is a phase change material. 
     
     
         44 . A thermal management system according to  claim 43 , in which the material has a solid-liquid phase change in a temperature range which is to be managed by the system. 
     
     
         45 . A thermal management system according to  claim 43 , in which the material subject to a phase change comprises particles increasing its thermal conductivity. 
     
     
         46 . A thermal management system according to  claim 29 , in which the variable volume material is a monophasic material. 
     
     
         47 . A thermal management system according to  claim 29 , in which the variable-volume material is functionalized such that it has a given electrical conductivity, sensitivity to magnetic fields, or is subject to a photoluminescence phenomenon. 
     
     
         48 . A thermal management system according to  claim 29 , in which the substrate is a material of low thermal conductivity. 
     
     
         49 . A thermal management system according to  claim 29 , in which the substrate is a thermally insulating material. 
     
     
         50 . A thermal management system according to  claim 29 , in which the substrate is surface-insulated thermally conducting. 
     
     
         51 . A thermal management system according to  claim 29 , in which the heat conductors are metal. 
     
     
         52 . A thermal management assembly comprising at least two systems according to  claim 29 , in which the switch of one of the systems is controlled by the first system. 
     
     
         53 . A thermal management assembly according to  claim 52 , in which control is provided by a temperature of the material of the switch of the first system, or that of a heat source or that of a heat sink. 
     
     
         54 . A thermal management assembly according to  claim 52 , in which the material of the first system is different than that of the second system. 
     
     
         55 . An electronic device comprising at least one thermal management system according to  claim 29  and/or at least one thermal management assembly. 
     
     
         56 . An electronic device according to  claim 55 , in which the heat source is formed by at least one electronic component, and at least one heat sink is formed by a heat exchanger. 
     
     
         57 . A thermal management system according to  claim 29 , in which the material is a liquid monophasic material. 
     
     
         58 . A thermal management system according to  claim 50 , in which the substrate is a silicon substrate with an oxide layer on its face, on which the first and second heat conductors are formed.