US2014167795A1PendingUtilityA1

Active feedback silicon failure analysis die temperature control system

Assignee: TEXAS INSTRUMENTS INCPriority: Dec 14, 2012Filed: Dec 14, 2012Published: Jun 19, 2014
Est. expiryDec 14, 2032(~6.4 yrs left)· nominal 20-yr term from priority
G01R 31/2874G01R 31/2867
22
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Claims

Abstract

Fault analysis of high power integrated circuits face thermal management challenges. This invention employs thermal diodes incorporated in the device undergoing fault analysis, and a closed loop microprocessor controlled feedback system for thermal control during test and fault analysis.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An integrated circuit test handler for a device undergoing failure analysis having at least one thermal diode comprising:
 a device under test board adapted to receive a integrated circuit for test;   an electrical connector for coupling to said at least one thermal diode on the integrated circuit;   a microcontroller connected to said electrical connector programmed to
 compare a temperature corresponding to signals from the at least one thermal diode on the integrated circuit to a temperature set point thereby generating an error signal, and 
 compute a solenoid drive signal from said error signal; 
   a source of cooling fluid;   a valve coupled to the source of cooling fluid, said valve having an open state supplying cooling fluid to bathe the integrated circuit and a closed state excluding cooling fluid from the integrated circuit; and   a solenoid receiving said solenoid drive signal and controlling the open/closed state of said valve.   
     
     
         2 . The integrated circuit test handler of  claim 1 , wherein:
 said cooling fluid is boiled liquid nitrogen.   
     
     
         3 . The integrated circuit test handler of  claim 1 , wherein:
 said cooling fluid is compressed air.   
     
     
         4 . The integrated circuit test handler of  claim 1 , further comprising:
 an I 2 C interface connected by said electrical connector to said at least one thermal diode generating a signal suitable for reading by said microcontroller.   
     
     
         5 . The integrated circuit test handler of  claim 4 , further comprising:
 said I 2 C interface is mounted on said device under test board.   
     
     
         6 . The integrated circuit test handler of  claim 5 , further comprising:
 said microcontroller is mounted on a circuit board separate from said device under test board.   
     
     
         7 . The integrated circuit test handler of  claim 1 , wherein:
 said microcontroller is programmed to compute a solenoid drive signal by
 forming a Proportional-Integral-Derivative function of said error signal, and 
 converting said Proportional-Integral-Derivative function into a pulse width modulated drive function for said solenoid. 
   
     
     
         8 . The integrated circuit test handler of  claim 1 , further comprising:
 a solenoid drive circuit connected to said microcontroller receiving said pulse width modulated drive function and generating an amplified solenoid drive function suitable for controlling said solenoid.   
     
     
         9 . The integrated circuit test handler of  claim 8 , wherein:
 said solenoid drive circuit includes an operational amplifier.   
     
     
         10 . The integrated circuit test handler of  claim 1 , further comprising:
 a lid with a central opening covering said integrated circuit and exposing the surface of said integrated circuit;   an inlet port on said lid operable to receive said cooling fluid;   a plurality of gas channels operable to evenly distribute said cooling fluid around the circumference of said lid;   a plurality of gas injection ports connected to said gas channels operable to distribute the cooling fluid to the surface of said integrated circuit.

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