US2014170382A1PendingUtilityA1

Functional film manufacturing method and functional film

Assignee: FUJIFILM CORPPriority: Aug 31, 2011Filed: Feb 20, 2014Published: Jun 19, 2014
Est. expiryAug 31, 2031(~5.1 yrs left)· nominal 20-yr term from priority
Inventors:Eijiro Iwase
C23C 16/308B05D 7/54C08L 2312/08B05D 7/04C08J 2333/14B05D 1/265C23C 16/403C09D 123/04Y10T428/24372C23C 16/345C09D 133/08C23C 16/545C23C 16/50B05D 3/06C23C 16/401C23C 16/56C23C 16/0272C08J 7/048B05D 2252/02C09D 5/00C08J 7/06C08J 2433/04C08J 7/0423
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Claims

Abstract

A functional film manufacturing method, in manufacturing a functional film having an organic layer on a support and an inorganic layer on the organic layer, comprises steps of preparing a coating material containing an organic compound which has a glass transition temperature of 100° C. or higher and is to be the organic layer, and an organic solvent; coating a support surface with 5 cc/m 2 or more of the coating material such that the organic layer thickness becomes 0.05 to 3 μm; forming the organic layer by drying the coating material on the support surface such that the coating material has a viscosity of 20 cP or higher and a surface tension of 34 mN/m or less in a decreasing-rate-of-drying state, and curing the organic compound; and forming the inorganic layer on the organic layer surface by a vapor phase deposition method accompanied by generation of plasma.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A functional film manufacturing method, in manufacturing a functional film having an organic layer on a support and an inorganic layer on the organic layer, comprising the steps of:
 preparing a coating material containing an organic compound which has a glass transition temperature of 100° C. or higher and is to be the organic layer, and an organic solvent;   coating a surface of the support with the coating material in an amount of 5 cc/m 2  or more such that a thickness of the organic layer becomes 0.05 to 3 μm;   forming the organic layer by drying the coating material coated on the surface of the support such that the coating material has a viscosity of 20 cP or higher and a surface tension of 34 mN/m or less in a decreasing-rate-of-drying state, and then curing the organic compound; and   forming the inorganic layer on a surface of the formed organic layer by a vapor phase deposition method accompanied by generation of plasma.   
     
     
         2 . The functional film manufacturing method according to  claim 1 , wherein the coating material contains a surfactant in a concentration of, excluding the organic solvent, 0.005 to 7% by weight. 
     
     
         3 . The functional film manufacturing method according to  claim 1 , wherein the support is coated with the coating material by a die coating method. 
     
     
         4 . The functional film manufacturing method according to  claim 1 , wherein the viscosity of the coating material to be coated on the support is 0.8 to 10 cP. 
     
     
         5 . The functional film manufacturing method according to  claim 1 , wherein the inorganic layer is formed by the vapor phase deposition method accompanied by generation of plasma while the support on which the organic layer has been formed is transported in a predetermined direction. 
     
     
         6 . The functional film manufacturing method according to  claim 5 , wherein the support is drawn from a support roll obtained by rolling up the support having a long length to form a roll shape, the organic layer is formed by coating the support with the coating material, drying the coating material and curing the organic compound while the drawn support is transported in a longitudinal direction, and the support on which the organic layer has been formed is rolled up again to form a roll shape to obtain a support/organic layer roll; and
 the support on which the organic layer has been formed is drawn from the support/organic layer roll, the inorganic layer is formed while the support is transported in the longitudinal direction, and the support on which the inorganic layer has been formed is rolled up again to form a roll shape.   
     
     
         7 . The functional film manufacturing method according to  claim 1 , wherein the organic compound contained in the coating material is a (meth)acrylate-based organic compound which is crosslinked by photopolymerization reaction. 
     
     
         8 . The functional film manufacturing method according to  claim 1 , wherein the inorganic layer is formed of one of silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide. 
     
     
         9 . A functional film comprising:
 a support;   an organic layer formed on the support; and   an inorganic layer formed on the organic layer,   wherein the support has on its surface 10 or more foreign substances per 1 cm 2 ; and   the organic layer contains an organic compound having a glass transition temperature of 100° C. or higher as a main component and has a film thickness of 0.05 to 3 μm being smaller than a size of at least one of the foreign substances on the surface of the support in a film thickness direction.   
     
     
         10 . The functional film according to  claim 9 , wherein the organic layer contains 0.005 to 7% by weight of a surfactant. 
     
     
         11 . The functional film according to  claim 9 , wherein the organic layer is formed by coating a coating material containing a component that is to be the organic layer. 
     
     
         12 . The functional film according to  claim 9 , further comprising a protective organic layer as an uppermost layer. 
     
     
         13 . The functional film according to  claim 9 , further comprising one or more combinations of a middle organic layer as a lower layer and a middle inorganic layer as an upper layer on the inorganic layer. 
     
     
         14 . The functional film according to  claim 9 , wherein the organic layer, and optionally a middle organic layer, is obtained by crosslinking a (meth)acrylate-based organic compound by polymerization reaction. 
     
     
         15 . The functional film according to  claim 9 , wherein the inorganic layer is formed of one of silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide.

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