Polishing pad

Abstract

A polishing pad comprising at least a polishing layer and a cushion layer, wherein a groove is formed on a polishing surface of the polishing pad, at least one of angles formed by the polishing surface and a side surface of the groove which continues to the polishing surface is 105-150° inclusive, and the cushion layer has a strain constant of 7.3×10 −6 to 4.4×10 −4 μm/Pa inclusive. The use of the polishing pad can achieve a purpose of preventing the fluctuation in a polishing rate while keeping the polishing rate at a high level.

1 . A polishing pad comprising at least a polishing layer and a cushion layer, wherein a groove is formed on a polishing surface of the polishing pad, at least one of angles formed by the polishing surface and a side surface of the groove which continues to the polishing surface is 105° or more and 150° or less, and the cushion layer has a strain constant of at least 7.3×10 −6  μm/Pa and at most 4.4×10 −4  μm/Pa. 
     
     
         2 . The polishing pad according to  claim 1 , wherein the cushion layer has a strain constant of at most 3.0×10 −4  μm/Pa. 
     
     
         3 . The polishing pad according to  claim 1 , wherein the cushion layer has a strain constant of at most 1.5×10 −4  μm/Pa. 
     
     
         4 . The polishing pad according to  claim 1 , wherein a pattern of the groove of the polishing surface is grid-shaped. 
     
     
         5 . The polishing pad according to  claim 2 , wherein a pattern of the groove of the polishing surface is grid-shaped. 
     
     
         6 . The polishing pad according to  claim 3 , wherein a pattern of the groove of the polishing surface is grid-shaped.