US2014173535A1PendingUtilityA1
Analysis of chip-mean variation and independent intra-die variation for chip yield determination
Est. expiryDec 17, 2032(~6.4 yrs left)· nominal 20-yr term from priority
G06F 30/398G06F 2111/08G06F 30/367G11C 29/56008G06F 17/5081
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Claims
Abstract
Systems and methods for determining a chip yield are disclosed. One method includes obtaining a first probability distribution function modeling variations within a chip and a second probability distribution function modeling variations between dies. Further, a discontinuous first level integration is performed with the first probability distribution function and a continuous second level integration is performed by a hardware processor based on the second probability function to determine the chip yield.
Claims
exact text as granted — not AI-modified1 . A method for determining a chip yield comprising:
obtaining a first probability distribution function modeling variations within a chip and a second probability distribution function modeling variations between dies; performing a discontinuous first level integration with the first probability distribution function; and performing, by a hardware processor, a continuous second level integration based on the second probability function to determine the chip yield.
2 . The method of claim 1 , wherein the first probability distribution function is based on a first plurality of random variables and wherein the second probability distribution function is based on second plurality of random variables.
3 . The method of claim 2 , wherein the first plurality of random variables account for variations between elements of an array of the chip.
4 . The method of claim 2 , wherein the first level integration is based on a chip success function that nullifies the first probability distribution function at values of the first and second pluralities of random variables if a cell fails at said values.
5 . The method of claim 1 , wherein the performing the discontinuous first level integration implements a Monte Carlo method.
6 . The method of claim 1 , wherein the performing the discontinuous first level integration implements a boundary search method.
7 . The method of claim 1 , wherein the performing the continuous second level integration further comprises performing a stochastic collocation.
8 . The method of claim 7 , wherein the stochastic collocation is based on a sparse grid for random variables upon which the second probability distribution function is based.
9 . A method for determining an array yield for a chip comprising:
generating sparse grid points for a first set of random variables modeling variations between dies; for each of the sparse grid points, determining a cell yield by solving a first level integration with a first probability distribution function modeling variations within the chip; and computing, by a hardware processor, the array yield for the chip by solving a second level integration based on the determined cell yields.
10 . The method of claim 9 , wherein said computing comprises performing stochastic collocation.
11 . The method of claim 10 , wherein said computing comprises performing a summation over the sparse grid points based on the cell yields.
12 . The method of claim 11 , wherein the sparse grid points are sparse grid quadrature points and wherein terms of said summation include quadrature weights.
13 . The method of claim 9 , wherein the first probability distribution function is based on a second set of random variables.
14 . The method of claim 13 , wherein the second set of random variables account for variations between elements of an array of the chip.
15 . The method of claim 14 , wherein the first level integration is based on a chip success function that nullifies the first probability distribution function at values of the first and second sets of random variables if a cell fails at said values.
16 . A method for determining a chip yield comprising:
obtaining a first probability distribution function modeling variations within a chip and a second probability distribution function modeling variations between dies; solving a first level integration problem based on the first probability distribution function at a first level solver; transmitting cell yield functions from the first level solver through an interface to a second level solver; and performing, by a hardware processor, at the second level solver, a second level integration based on the cell yield functions to determine the chip yield.
17 . The method of claim 16 , wherein the method further comprises:
selecting the first level solver from a plurality of first level solvers.
18 . The method of claim 17 , wherein the interface is a common interface such that cell yield functions are receivable at the second level solver from each of said first level solvers through the common interface.
19 . The method of claim 16 , wherein the method further comprises:
adding the first level solver to a plurality of first level solvers from which cell yield functions are transmittable through said interface.
20 . The method of claim 16 , wherein the method further comprises:
modifying the first level solver.Join the waitlist — get patent alerts
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