Heat dissipation device

Abstract

A heat dissipation device includes a first board body and a second board body. The first board body has a first face and a second face. The second face is formed with a rough structure. The second board body has a third face and a fourth face. The fourth face is mated with the second face and covered by the second face. The second and fourth faces together define a chamber. A working fluid is filled in the chamber. The rough structure is coated with a coating. By means of the rough structure and the coating, the cost for the heat dissipation device is reduced and the thermal resistance of the heat dissipation device is lowered.

What is claimed is: 
     
         1 . A heat dissipation device comprising:
 a first board body having a first face and a second face, the second face being formed with a rough structure; and   a second board body having a third face and a fourth face, the fourth face of the second board body being mated with the second face of the first board body and covered by the second face, the second and fourth faces together defining a chamber, a working fluid being filled in the chamber.   
     
     
         2 . The heat dissipation device as claimed in  claim 1 , wherein a heat source is attached to the third face. 
     
     
         3 . The heat dissipation device as claimed in  claim 2 , wherein the rough structure of the second face or the fourth face is coated with a coating. 
     
     
         4 . The heat dissipation device as claimed in  claim 3 , wherein both the rough structure of the second face and the fourth face are coated with coatings. 
     
     
         5 . The heat dissipation device as claimed in  claim 4 , wherein the second face is partially or totally formed with the rough structure. 
     
     
         6 . The heat dissipation device as claimed in  claim 5 , wherein the second face is partially formed with the rough structure and the rough structure is positioned right above the heat source. 
     
     
         7 . The heat dissipation device as claimed in  claim 3 , wherein the coating is a hydrophilic coating or a hydrophobic coating. 
     
     
         8 . The heat dissipation device as claimed in  claim 1 , wherein the working fluid is selected from a group consisting of pure water, methanol, acetone, coolant and ammonia. 
     
     
         9 . The heat dissipation device as claimed in  claim 6 , wherein the rough structure of the second face is a capillary structure with micro-channels, the capillary structure being formed by means of mechanical processing or etching. 
     
     
         10 . The heat dissipation device as claimed in  claim 9 , wherein the mechanical processing is stamping, marking or sculpturing. 
     
     
         11 . The heat dissipation device as claimed in  claim 1 , wherein the rough structure has a recessed/raised form, a waved form or a saw-toothed form. 
     
     
         12 . The heat dissipation device as claimed in  claim 1 , wherein the second board body has a capillary structure formed on the fourth face. 
     
     
         13 . The heat dissipation device as claimed in  claim 12 , wherein the capillary structure is selected from a group consisting of channeled structure, sintered powder body and mesh body. 
     
     
         14 . The heat dissipation device as claimed in  claim 1 , wherein at least one support pillar is disposed in the chamber, two ends of the support pillar being respectively connected to the second face and the fourth face, a capillary structure being disposed on an outer surface of the support pillar. 
     
     
         15 . The heat dissipation device as claimed in  claim 14 , wherein the capillary structure is selected from a group consisting of channeled structure, sintered powder body and mesh body. 
     
     
         16 . The heat dissipation device as claimed in  claim 3 , wherein the coating is a dioxide silicon coating.