Resin composition for heat dissipation and heat dissipating substrate manufactured by using the same

Abstract

Disclosed herein are a resin composition for heat dissipation, including: an insulating material; a first filler added to the insulating material and having a plate shaped carbon material; and a second filler added to the insulating material, and having a carbon material having a higher aspect ratio than the first filler.

What is claimed is: 
     
         1 . A resin composition for heat dissipation, comprising:
 an insulating material;   a first filler added to the insulating material and having a plate shaped carbon material; and   a second filler added to the insulating material, and having a carbon material having a higher aspect ratio than the first filler.   
     
     
         2 . The resin composition for heat dissipation according to  claim 1 , wherein the first filler includes graphene or graphene oxide, and wherein the second filler includes carbon nanotube. 
     
     
         3 . The resin composition for heat dissipation according to  claim 1 , wherein a total content of the first filler and the second filler is below 3 wt % based on the resin composition for heat dissipation. 
     
     
         4 . The resin composition for heat dissipation according to  claim 1 , wherein the insulating material includes a polymer epoxy resin. 
     
     
         5 . The resin composition for heat dissipation according to  claim 1 , wherein the first filler and the second filler each are surface-coated with an inorganic material. 
     
     
         6 . The resin composition for heat dissipation according to  claim 5 , wherein the inorganic material includes at least any one of silica, titanium oxide (TiO 2 ), aluminum oxide (Al 2 O 3 ), boron nitride (BN), and zinc oxide (ZnO). 
     
     
         7 . A heat dissipating substrate manufactured by using a resin composition for heat dissipation, the resin composition having an insulating material; a first filler having a plate shaped carbon material; and a second filler having a carbon material having a higher aspect ratio than the first filler. 
     
     
         8 . The heat dissipating substrate according to  claim 7 , wherein the first filler forms a primary heat-conductive network in the insulating material, and wherein the second filler forms a secondary heat-conductive network by being inserted into the first filler in the insulating material. 
     
     
         9 . The heat dissipating substrate according to  claim 7 , wherein the first filler includes graphene or graphene oxide, surface-coated with an inorganic material, and wherein the second filler includes carbon nanotube surface-coated with an inorganic material.