Electronic assembly includes a composite carrier

Abstract

An electronic assembly includes a composite carrier. The composite carrier includes a package substrate including at least one embedded metal layer having its bottom surface secured to a semiconductor wafer. The composite carrier minimizes effects of the CTE mismatch between the die and the package substrate during assembly reduces warpage of the die. A plurality of first die having a thickness having their topside contacts attached to topside substrate pads on a top surface of said package substrate.

I claim: 
     
         1 - 30 . (canceled) 
     
     
         31 . An electronic assembly, comprising:
 a composite carrier comprising an organic package substrate including at least one embedded metal layer having its bottom surface secured to a semiconductor wafer, and   a plurality of first die having having their topside contacts attached to topside substrate pads on a top surface of said package substrate.   
     
     
         32 . The electronic assembly of  claim 31 , wherein said plurality of first die comprise through substrate via (TSV) die that include TSVs that have said topside contacts coupled to said TSVs attached to topside substrate pads of said package substrate. 
     
     
         33 . The electronic assembly of  claim 31 , further comprising a plurality of singulated second die attached to bottomside contacts that are coupled to said TSVs. 
     
     
         34 . The electronic assembly of  claim 31 , wherein said semiconductor wafer comprises a silicon wafer. 
     
     
         35 . The electronic assembly of  claim 31 , wherein said plurality of first die are disposed on a first wafer. 
     
     
         36 . The electronic assembly of  claim 31 , wherein said plurality of first die have a thickness of 20 to 100 μm having.