Method and apparatus for cleaning grinding work chuck using a scraper

Abstract

A scraper assembly for removing debris deposited on the surface of a porous work chuck during a wafer grinding process.

What is claimed is: 
     
         1 . A method for cleaning particles from the surface of a circular cylinder shaped and rotatable work chuck used in a grind apparatus comprising the steps of:
 providing a work chuck having first and second surfaces, said work chuck being operable in conjunction with said grind apparatus;   positioning a scraper device adjacent said first surface of said work chuck; and   activating said scraper device whereby said particles are substantially removed from the first surface of said work chuck.   
     
     
         2 . The method of  claim 1  wherein said work chuck has an edge portion along its perimeter. 
     
     
         3 . The method of  claim 2  wherein said scraper device is positioned above said edge portion of said work chuck. 
     
     
         4 . A grind apparatus for grinding a surface of a workpiece comprising:
 a grind wheel;   a porous work chuck having top and bottom surfaces;   means for rotating said work chuck and said grind wheel;   a scraper device positioned adjacent to said top surface of said work chuck;   means for moving said scraper device across the top surface of said work chuck; and   means for energizing said scraper device whereby particles on the top surface of said work chuck remaining after grinding of said workpiece are substantially removed.