Cooling device and a cooling assembly comprising the cooling device

Abstract

A cooling device comprises a heat sink having fins and a piezofan having a piezoelectric element attached to a planar body. The planar body is capable of oscillating at a movable end in response to applying alternating electric current to the piezoelectric element, thereby generating an air flow toward an output of the cooling device. A plurality of fins is located between the movable end of the planar body and the output end of the cooling device. Each fin has a planar form with a main surface being substantially aligned with the air flow. A cooling assembly comprising such cooling device is also disclosed.

What is claimed is: 
     
         1 . A cooling device comprising a heat sink and a piezofan; the heat sink comprising a plurality of fins of a thermally conductive material and the piezofan comprising a piezoelectric element attached to a planar body, the planar body being configured to oscillate at a movable end in response to applying alternating electric current to said piezoelectric element and generating an air flow from an input end of the device to an output end of the device, wherein a plurality of fins are located between the movable end of the planar body and the output end of the cooling device; each fin having a planar form with a main surface being substantially aligned with said air flow. 
     
     
         2 . The cooling device of  claim 1 , wherein the piezofan and the plurality of fins are located between side walls. 
     
     
         3 . The cooling device of  claim 2 , wherein a side wall comprises a protuberant portion having a surface configured for directing said air flow toward said plurality of fins. 
     
     
         4 . The cooling device of  claim 1 , wherein the piezoelectric element and the planar body are mounted on a support element attached to the heat sink with a damping material positioned between the support element and heat sink configured for isolating or reducing a vibration caused by the operation of piezofan. 
     
     
         5 . The cooling device of  claim 4 , wherein the support element is a rigid rail. 
     
     
         6 . A cooling assembly comprising a heat sink and a piezofan; the heat sink comprising a plurality of fins of a thermally conductive material and the piezofan comprising a piezoelectric element attached to a planar body, the planar body being configured to oscillate at a movable end in response to applying alternating electric current to said piezoelectric element and generating an air flow from an input end of the device to an output end of the device, wherein a plurality of fins are located between the movable end of the planar body and the output end of the cooling device; each fin having a planar form with a main surface being substantially aligned with said air flow. 
     
     
         7 . The cooling assembly of  claim 6 , wherein a first cooling assembly with a first piezofan is assembled with a second cooling assembly with a second piezofan, wherein the first piezofan is configured to oscillate out of phase with respect to the second piezofan.