US2014218851A1PendingUtilityA1
Shield Can
Est. expiryFeb 1, 2033(~6.5 yrs left)· nominal 20-yr term from priority
Inventors:Stephen C. KleinTodd David PleakeDaniel M. GalelIvan Andrew MccrackenMark Mitchell GlosterDuane Martin EvansTony N. Kfoury
G06F 1/1626H05K 9/0032Y10T29/49128H05K 2201/10371H05K 1/147G06F 1/182H05K 3/20G06F 1/16H05K 9/0066
52
PatentIndex Score
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Claims
Abstract
A shield can is described. In one or more implementations, a shield can includes a frame configured to be installed on a printed circuit board. The shield can also includes a lid configured to be connected to the frame after installation of the frame to form the shield can over one or more components that are installed on the PCB.
Claims
exact text as granted — not AI-modified1 . A shield can comprising:
a frame configured to be installed on a printed circuit board (PCB); and a lid configured to be connected to the frame after installation of the frame to form the shield can over one or more components that are installed on the PCB including one or more flexible printed circuits (FPCs).
2 . A shield can as recited in claim 1 , wherein the lid is configured to be connected to the frame via adhesive.
3 . A shield can as recited in claim 1 , wherein the lid is configured to be connected to the frame via a mechanical latch.
4 . A shield can as recited in claim 1 , wherein the lid comprises:
one or more protrusions that are configured to latch with one or more corresponding indentations that are disposed on the frame; or one or more indentations that are configured to latch with one or more corresponding protrusions that are disposed on the frame.
5 . A shield can as recited in claim 1 , wherein the lid comprises a non-magnetic material.
6 . A shield can as recited in claim 1 , wherein the frame comprises dimples that are disposed around a perimeter of the frame and which are arranged to create an electromagnetic interference (EMI) shield.
7 . A shield can as recited in claim 1 , wherein the lid comprises a flange disposed along at least one side of the lid, wherein the flange of the lid is configured to be adhered to one of a conductive foam or a conductive pressure sensitive adhesive (PSA).
8 . A shield can as recited in claim 1 , wherein the shield can is configured to permit at least one of said flexible printed circuits (FPCs) to exit the shield can through a gap in the frame of the shield can.
9 . A shield can as recited in claim 1 , wherein the frame comprises a cross bar that is configured to be removed after placement of the frame on the PCB.
10 . A computing device comprising:
one or more components configured to produce an electromagnetic field; and a shield can configured to provide an electromagnetic shield for the one or more components, the shield can including at least a lid connected to a frame that is installed on a printed circuit board (PCB).
11 . A computing device as recited in claim 10 , wherein the frame includes dimples disposed along a perimeter of the frame to create an electromagnetic interference (EMI) shield.
12 . A computing device as recited in claim 10 , wherein the lid is connected to the frame via a pressure sensitive adhesive (PSA).
13 . A computing device as recited in claim 10 , wherein the lid is connected to the frame using one or more mechanical latches.
14 . A computing device as recited in claim 13 , wherein each mechanical latch includes a protrusion and an indentation, the protrusion disposed on one of the frame or the lid, the indentation disposed on the other of the frame or the lid.
15 . A computing device as recited in claim 14 , wherein the lid is removable and comprises a non-conductive inner surface.
16 . A method comprising:
connecting a frame to a printed circuit board (PCB); installing one or more flexible printed circuits (FPCs) on the PCB; and connecting a lid to the frame to form a shield can over the one or more FPCs.
17 . A method as recited in claim 16 , wherein said connecting the frame to the PCB includes:
using a cross-bar connected to the frame to place the frame on the PCB; soldering the frame to the PCB; and removing the cross-bar from the frame.
18 . A method as recited in claim 17 , further comprising removing the cross-bar by sniping or bending.
19 . A method as recited in claim 17 , wherein the lid includes one or more holes position such that a burr left after removal of the cross-bar from the frame is disposed through a respective said hole.
20 . A method as recited in claim 16 , wherein connecting the lid to the frame comprises:
connecting one or more protrusions disposed on the lid that are configured to latch with one or more corresponding indentations that are disposed on the frame; or connecting one or more indentations disposed on the lid that are configured to latch with one or more corresponding protrusions that are disposed on the frame.Join the waitlist — get patent alerts
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