Alloys with low coefficient of thermal expansion as pdc catalysts and binders

Abstract

A cutting table includes a lattice structure and a catalyst material deposited within voids formed within the lattice structure. The catalyst material is deposited in the voids during a sintering process that forms the lattice structure. The catalyst material facilitates the growth of the lattice structure. The catalyst material has a coefficient of thermal expansion that is less than that of cobalt.

What is claimed is: 
     
         1 . A cutting table, comprising:
 a lattice structure forming interstitial spaces therein; and   a catalyst material deposited within the interstitial spaces during a sintering process that forms the lattice structure, the catalyst material facilitating the growth of the lattice structure, the catalyst material having a coefficient of thermal expansion that is less than the coefficient of thermal expansion of cobalt.   
     
     
         2 . The cutting table of  claim 1 , wherein the catalyst material is selected from a group consisting of chromium, tantalum, and ruthenium. 
     
     
         3 . The cutting table of  claim 1 , wherein the catalyst material is selected from a group consisting of alloys of cobalt, alloys of a Group VIII metal and at least one non-catalyst metal, and alloys of two or more Group VIII metals. 
     
     
         4 . The cutting table of  claim 1 , wherein the catalyst material comprises a eutectic alloy, the eutectic alloy comprising a eutectic composition. 
     
     
         5 . The cutting table of  claim 1 , wherein the catalyst material comprises a near eutectic alloy. 
     
     
         6 . The cutting table of  claim 1 , wherein the catalyst material has a thermal conductivity that is greater than the thermal conductivity of cobalt. 
     
     
         7 . The cutting table of  claim 1 , wherein the lattice structure comprises a polycrystalline diamond. 
     
     
         8 . A cutter, comprising:
 a substrate comprising a top surface;   a cutting table, comprising:
 a cutting surface; 
 an opposing surface coupled to the top surface; 
 a cutting table outer wall extending from the circumference of the opposing surface to the circumference of the cutting surface; 
 a lattice structure forming interstitial spaces therein; and 
 a catalyst material deposited within the interstitial spaces during a sintering process that forms the lattice structure, the catalyst material facilitating the growth of the lattice structure, the catalyst material having a coefficient of thermal expansion that is less than the coefficient of thermal expansion of cobalt. 
   
     
     
         9 . The cutter of  claim 8 , wherein the catalyst material is selected from a group consisting of chromium, tantalum, and ruthenium. 
     
     
         10 . The cutter of  claim 8 , wherein the catalyst material is selected from a group consisting of alloys of cobalt, alloys of a Group VIII metal and at least one non-catalyst metal, and alloys of two or more Group VIII metals. 
     
     
         11 . The cutter of  claim 8 , wherein the catalyst material comprises a eutectic alloy, the eutectic alloy comprising a eutectic composition. 
     
     
         12 . The cutter of  claim 8 , wherein the catalyst material comprises a near eutectic alloy. 
     
     
         13 . The cutter of  claim 8 , wherein the catalyst material has a thermal conductivity that is greater than the thermal conductivity of cobalt. 
     
     
         14 . The cutter of  claim 8 , wherein the lattice structure comprises a polycrystalline diamond. 
     
     
         15 . The cutter of  claim 8 , wherein the substrate is formed from a substrate powder and a binder material, the binder material cementing the substrate powder to form the substrate, the binder material being the same as the catalyst material. 
     
     
         16 . The cutter of  claim 15 , wherein the catalyst material originates in the substrate and infiltrates into the cutting table. 
     
     
         17 . The cutter of  claim 8 , wherein the substrate is formed from a substrate powder and a binder material, the binder material cementing the substrate powder to form the substrate, the binder material being different than the catalyst material. 
     
     
         18 . The cutter of  claim 17 , wherein the melting point of the catalyst material is lower than the melting point of the binder material.