Electronic Packages and Components Thereof Formed by Co-Deposited Carbon Nanotubes

Abstract

Microelectronic packages may be formed using the co-deposition of carbon nanotubes. The carbon nanotubes may be functionalized to have an appropriate charge so they can be combined with other materials to give suitable properties. The other materials that are co-deposited may include metals, ceramics, and polymers. The electronic package components may be formed including thermal interface materials, vias, trenches, capacitors, memories, substrates, and substrate cores, as a few examples.

What is claimed is: 
     
         1 . A method comprising:
 forming a microelectronic package using co-deposition of carbon nanotubes and another material.   
     
     
         2 . The method of  claim 1  including functionalizing said carbon nanotubes. 
     
     
         3 . The method of  claim 2  including co-depositing functionalized carbon nanotubes with a metal. 
     
     
         4 . The method of  claim 2  including co-depositing functionalized carbon nanotubes with a polymer. 
     
     
         5 . The method of  claim 2  including co-depositing functionalized carbon nanotubes with ceramic. 
     
     
         6 . The method of  claim 1  including co-depositing the carbon nanotubes in an electrolytic bath. 
     
     
         7 . The method of  claim 1  including using selective co-deposition of carbon nanotubes. 
     
     
         8 . The method of  claim 1  including co-depositing carbon nanotubes with a conductive material. 
     
     
         9 . The method of  claim 1  including co-depositing carbon nanotubes with a non-conductive material. 
     
     
         10 . The method of  claim 1  including co-depositing carbon nanotubes in a depression in a substrate.