US2014251782A1PendingUtilityA1

In-molded resistive and shielding elements

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Assignee: T INK INCPriority: Apr 20, 2007Filed: Jan 31, 2014Published: Sep 11, 2014
Est. expiryApr 20, 2027(~0.8 yrs left)· nominal 20-yr term from priority
Y10T29/49082H03K 17/9622B29C 45/14639H01H 11/04B29K 2995/0011H03K 2217/96019B29C 2045/14237B29L 2031/466H03K 2217/960785H03K 2217/96079H03K 2217/960755H03K 17/962H05K 9/0092
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Claims

Abstract

An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film.

Claims

exact text as granted — not AI-modified
1 - 15 . (canceled) 
     
     
         16 . An article of manufacture having at least one of an in-molded resistive element and an in-molded shielding element, comprising:
 a plastic film having a front surface and a back surface;   at least one printed conductive ink layer to create at least one of the in-molded resistive element and the in-molded shielding element printed on the front or back surface of the plastic film;   at least one printed non-conductive layer applied on top or underneath the printed conductive ink layer; and   a plastic support structure,   wherein the front or back surface of the plastic film faces the plastic support structure, and   wherein the plastic film is bonded to the plastic support structure.   
     
     
         17 . The article of  claim 16 , wherein at least a portion of the front or back surface of the film is exposed to the plastic support structure. 
     
     
         18 . The article of  claim 16 , wherein at least one of the non-conductive layers is a dielectric layer. 
     
     
         19 . The article of  claim 16 , wherein at least one of the in-molded resistive element and the in-molded shielding element is not exposed to the plastic support structure. 
     
     
         20 . The article of  claim 16 , wherein at least one of the in-molded resistive element and the in-molded shielding element is exposed to the plastic support structure. 
     
     
         21 . The article of  claim 16 , wherein at least one of the conductive ink layers is a ground layer. 
     
     
         22 . The article of  claim 16 , further comprising at least one connector electrically connected to the at least one of the in-molded resistive element and the in-molded shielding element, wherein a portion of the at least one connector projects away from the plastic support structure. 
     
     
         23 . The article of  claim 16 , comprising at least one connector molded into the plastic support structure and electrically connected to the at least one of the in-molded resistive element and the in-molded shielding element. 
     
     
         24 . The article of  claim 16 , wherein the plastic support structure is a molded plastic support structure. 
     
     
         25 . The article of  claim 16 , further comprising printed graphic indicia on at least one surface of the plastic support structure or the plastic film.

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