US2014252670A1PendingUtilityA1

In-molded resistive and shielding elements

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Assignee: T INK INCPriority: Apr 20, 2007Filed: Jan 31, 2014Published: Sep 11, 2014
Est. expiryApr 20, 2027(~0.8 yrs left)· nominal 20-yr term from priority
H03K 2217/960785H03K 17/9622Y10T29/49082H01H 11/04B29K 2995/0011H03K 17/962B29L 2031/466B29C 45/14639H03K 2217/960755H03K 2217/96019H05K 9/0092H03K 2217/96079B29C 2045/14237
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Claims

Abstract

An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film.

Claims

exact text as granted — not AI-modified
1 - 15 . (canceled) 
     
     
         16 . A method for making an article, comprising:
 printing a conductive ink sensing zone on a film using one or more conductive inks, the one or more conductive inks forming a sensing zone being arranged to operate as capacitive switch;   placing the film into a mold;   introducing molten plastic into the mold to create a support structure for the film such that a portion of the conductive sensing zone is contoured to mate with a curved portion of the support structure.   
     
     
         17 . The method of  claim 16 , further comprising printing at least one non-conductive layer. 
     
     
         18 . The method of  claim 17 , wherein at least one non-conductive layer is a dielectric layer. 
     
     
         19 . The method of  claim 16 , wherein the at least one non-conductive layer substantially covers the conductive ink sensing zone. 
     
     
         20 . The method of  claim 16 , further comprising forming the formable film into a desired shape prior to placing the film into the mold. 
     
     
         21 . The method of  claim 20 , wherein the step of forming the formable film into a desired shape comprises vacuum thermoforming. 
     
     
         22 . The method of  claim 16 , wherein the step of forming the film into a desired shape comprises high pressure forming. 
     
     
         23 . The method of  claim 16 , further comprising removing the article from the mold. 
     
     
         24 . The method of  claim 16 , further comprising removing the article from the mold, wherein the sensing zone is not exposed. 
     
     
         25 . The method of  claim 16 , further comprising printing graphic indicia on at least one surface of the film or the support structure. 
     
     
         26 . The method of  claim 16 , wherein the curved portion forms a three dimensional structure.

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