In-molded resistive and shielding elements

Abstract

An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film.

1 - 15 . (canceled) 
     
     
         16 . A method for forming an article, comprising:
 printing at least one first conductive ink layer on the surface of a formable plastic film;   printing at least one non-conductive layer printed on the conductive ink layer;   printing at least one second conductive ink layer printed on the non-conductive layer; and   forming the formable film into a desired shape, thereby creating a formed film.   
     
     
         17 . The method of  claim 16 , wherein at least one non-conductive layer is a dielectric layer. 
     
     
         18 . The method of  claim 16 , wherein the at least one non-conductive layer substantially covers the at least one first conductive ink layer. 
     
     
         19 . The method of  claim 16 , wherein the at least one second conductive ink layer comprises a conductive ink layer sensing zone. 
     
     
         20 . The method of  claim 16 , wherein the forming is performed via pressure, vacuum, or hydroforming. 
     
     
         21 . The method of  claim 16 , wherein the article includes a capacitive switch. 
     
     
         22 . The method of  claim 16 , wherein the desired shape is three-dimensional. 
     
     
         23 . A method for forming an article, comprising:
 printing at least one conductive ink layer on the surface of a formable plastic film;   printing at least one non-conductive layer printed on the conductive ink layer; and   forming the formable film into a desired shape, thereby creating a formed film.   
     
     
         24 . The method of  claim 23 , wherein at least one non-conductive layer is a dielectric layer. 
     
     
         25 . The method of  claim 23 , wherein the at least one non-conductive layer substantially covers the at least one first conductive ink layer. 
     
     
         26 . The method of  claim 23 , wherein the at least one second conductive ink layer comprises a conductive ink layer sensing zone. 
     
     
         27 . The method of  claim 23 , wherein the forming is performed via pressure, vacuum, or hydroforming. 
     
     
         28 . The method of  claim 23 , wherein the article includes a capacitive switch. 
     
     
         29 . The method of  claim 23 , wherein the desired shape is three-dimensional.