Apparatus for molding electronic component

Abstract

A molding apparatus for an electronic device comprises a first mold chase, a second mold chase and a middle plate which is configured to be clamped together with the electronic device between the first mold chase and second mold chase during molding. A molding cavity formed in the middle plate is configured for receiving molding compound. A package pin is mounted on the middle plate to be movable with the middle plate, and a portion of the package pin is positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin.

What is claimed is: 
     
         1 . A molding apparatus for an electronic device, comprising:
 a first mold chase, a second mold chase and a middle plate including a molding cavity which is configured to be clamped between the first mold chase and second mold chase during molding;   at least one ejection pin extending from the first mold chase towards the bottom mold chase;   at least one receiving hole in the middle plate which is sized to allow the ejection pin to pass through the middle plate to contact a molded electronic device positioned on the second mold chase; and   a holding bush located at a base of the first mold chase through which the ejection pin is configured to pass;   wherein the holding bush is at least partially insertable into the receiving hole for guiding the ejection pin precisely into the receiving hole.   
     
     
         2 . The molding apparatus as claimed in  claim 1 , wherein the first mold chase further comprises a runner plate next to the first mold chase which contains runners for channeling molding compound through the runners to the molding cavity, and wherein the holding bush is incorporated into the runner plate. 
     
     
         3 . The molding apparatus as claimed in  claim 2 , wherein a part of the holding bush protrudes from the runner plate to be at least partially insertable into the receiving hole. 
     
     
         4 . The molding apparatus as claimed in  claim 3 , wherein the part of the holding bush protruding from the runner plate is substantially frustoconically shaped.