Light emitting diode package and method of fabricating the same

Abstract

A light emitting diode package and a method of fabricating the same. The package includes a light emitting diode chip having a first surface and a second surface opposing the first surface, a metal frame (or TAB tape) having leads connected to the light emitting diode chip, and a light-pervious encapsulant encapsulating the light emitting diode chip, wherein the second surface of the chip is exposed from the first light-pervious encapsulant. The metal frame (or TAB tape) connects the light emitting diode chip to an external circuit board. The LED package does not need wire-bonding process. A method of fabricating a light emitting diode package is also provided.

What is claimed is: 
     
         1 . A light emitting diode package, comprising:
 a light emitting diode chip having a first surface and a second surface opposing the first surface;   at least a first electrode pad formed on the first surface of the light emitting diode chip;   a metal frame having at least a first lead electrically connected to the at least a first electrode pad; and   a carrier component and a first light-pervious encapsulant, such that the light emitting diode chip is disposed on the carrier component, and the first light-pervious encapsulant is formed on the carrier component for encapsulating the light emitting diode chip and the first leads of the metal frame.   
     
     
         2 . The light emitting diode package of  claim 1 , wherein the at least a first lead is in a bending structure and has a first end and a second end opposing the first end, and the first end and the second end have a height difference for the light emitting diode chip to be received therein. 
     
     
         3 . The light emitting diode package of  claim 1 , further comprising a support layer having a plurality of opening areas, and wherein the at least a first lead each has a first end connected to the at least a first electrode pad and a second end opposing the first end, and both of the first end and the second end are exposed from a corresponding one of the opening areas. 
     
     
         4 . The light emitting diode package of  claim 3 , wherein the support layer is made of metal or polymer. 
     
     
         5 . The light emitting diode package of  claim 1 , wherein the carrier component has a dent, so as for the light emitting diode chip to be disposed in the dent, and the at least a first lead each has a first end connected to the at least a first electrode pads and a second end opposing the first end and connected to the carrier component. 
     
     
         6 . The light emitting diode package of  claim 1 , wherein the light emitting diode chip is disposed on the carrier component through the metal frame, allowing the metal frame to be sandwiched between the light emitting diode chip and the carrier component, and the first light-pervious encapsulant encapsulates the at least a first leads of the metal frame. 
     
     
         7 . The light emitting diode package of  claim 1 , further comprising at least a second electrode pad formed on the second surface of the light emitting diode chip, wherein the metal frame further comprises at least a second lead connected to the at least a second electrode pad. 
     
     
         8 . A method of fabricating a light emitting diode package, comprising:
 providing a light emitting diode chip having a first surface and a second surface opposing the first surface, and at least a first electrode pad formed on the first surface; and   connecting at least a the first lead of a metal frame to the at least a first electrode pad.   
     
     
         9 . The method of  claim 8 , further comprising forming on a carrier component on which the light emitting diode chip is disposed a first light-pervious encapsulant that encapsulates the light emitting diode chip. 
     
     
         10 . The method of  claim 9 , wherein the carrier component has a dent, the light emitting diode chip is disposed in the dent, and the at least a first lead each has a first end connected to the at least a first electrode pad and a second end opposing the first end and connected to the carrier component. 
     
     
         11 . The method of  claim 9 , wherein the light emitting diode chip is disposed on the carrier component through the metal frame, allowing the metal frame to be sandwiched between the light emitting diode chip and the carrier component, and the first light-pervious encapsulant encapsulates the at least a first lead of the metal frame. 
     
     
         12 . The method of  claim 8 , wherein the light emitting diode chip further comprises at least a second electrode pad formed on the second surface of the light emitting diode chip, and the metal frame further comprises at least a second lead connected to the at least a second electrode pad.