Multi-stage transfer mold manufacturing method, multi-stage transfer mold manufactured thereby, and component produced thereby

Abstract

A multi-stage transfer mold manufacturing method that can save labor in a step of connecting by a multi-stage connection, a multi-stage transfer mold manufactured thereby, and a component produced thereby are provided for production of a multi-stage component by electroplating. A method therefor includes the steps of forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate, a sidewall of the resist pattern forming a desired angle, forming, on the resist pattern, a resist pattern having a shape and a thickness of a connection pillar for connecting with an upper layer, creating a transfer mold by filling up the resist pattern on which the resist pattern having the shape of the connection pillar by electroplating to a predetermined thickness, and providing a master mold by separating the transfer mold from the metal substrate.

1 . A multi-stage transfer mold manufacturing method comprising steps of:
 forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate, a sidewall of the resist pattern on a metal substrate side forming a desired angle α less than 90°;   forming, on the resist pattern, a resist pattern having a shape and a thickness of a connection pillar for connecting with an upper layer;   filling up the resist pattern on which the resist pattern having the shape of the connection pillar by electroplating to a predetermined thickness and then separating a mold thus formed from the metal substrate leaving the metal substrate and the resist pattern.   
     
     
         2 . A multi-stage transfer mold manufacturing method comprising steps of:
 forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate, a sidewall of the resist pattern on a metal substrate side forming a desired angle α less than 90°;   forming, on the resist pattern, a resist pattern having a shape and a thickness of a connection pillar for connecting with an upper layer;   filling up the resist pattern on which the resist pattern having the shape of the connection pillar by electroplating to a predetermined thickness and then providing a master mold by separating a mold thus formed from the metal substrate leaving the metal substrate and the resist pattern;   creating a son mold by transferring by way of the master mold and a mother mold; and   providing a transfer mold by performing, on the son mold, a releasing layer formation process for facilitating a release of the component to be formed by electroplating and an insulation layer formation process for forming an insulation layer in that portion which is other than a portion in which the component is to be formed.   
     
     
         3 . The method according to  claim 1 , comprising a step of forming a surface roughening layer on a surface of the metal substrate as a first step. 
     
     
         4 . A multi-stage transfer mold manufacturing method comprising steps of:
 forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate, a sidewall of the resist pattern on a metal substrate side forming an angle of approximately 90°;   forming, on the resist pattern, a resist pattern having a shape and a thickness of a connection pillar for connecting with an upper layer;   filling up the resist pattern on which the resist pattern having the shape of the connection pillar by electroplating to a predetermined thickness and then separating a mold thus formed from the metal substrate leaving the metal substrate and the resist pattern;   removing a photoresist partially to leave a resist pattern layer in that portion on the separated mold which is other than a portion corresponding to the component to be transferred; and   treating the sidewall of the shape of the component with beam irradiation using the resist pattern layer as a protective layer, the beam irradiation being modulated such that the angle at the sidewall of the shape of the component is tailored to form approximately 90° or a desired angle α less than 90°.   
     
     
         5 . A multi-stage transfer mold manufacturing method comprising steps of:
 forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate, a sidewall of the resist pattern on a metal substrate side forming a desired angle α;   forming, on the resist pattern, a resist pattern having a shape and a thickness of a connection pillar for connecting with an upper layer;   by filling up the resist pattern on which the resist pattern having the shape of the connection pillar by electroplating to a predetermined thickness and then separating a mold thus formed from the metal substrate leaving the metal substrate and the resist pattern;   removing a photoresist partially to leave a resist pattern layer in that portion on the transfer mold which is other than a portion corresponding to the component to be transferred;   providing a master mold by treating the sidewall of the shape of the component with beam irradiation using the resist pattern layer as a protective layer, the beam irradiation being modulated such that the angle at the sidewall of the shape of the component is tailored to form approximately 90° or a desired angle α less than 90°;   creating a son mold by transferring by way of the master mold and a mother mold; and   performing, on the son mold, a releasing layer formation process for facilitating a release of the component to be formed by electroplating and an insulation layer formation process for forming an insulation layer in that portion which is other than a portion in which the component is to be formed.   
     
     
         6 . The method according to  claim 4 , comprising a step of forming a surface roughening layer of the metal substrate as a first step. 
     
     
         7 . A multi-stage transfer mold manufactured by the method according to  claim 1  having a cross-sectional surface with a desired aspect ratio, a sidewall of the cross-sectional surface forming an angle between 45° and 88°. 
     
     
         8 . A multi-stage transfer mold manufactured by the method according to  claim 2 . 
     
     
         9 . A component produced by electroplating, the component being molded by the electroplating using the multi-stage transfer mold according to  claim 8  and transferred.