US2014312367A1PendingUtilityA1

Light emitting diode package and method for manufacturing same

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Assignee: CHO BYOUNG-GUPriority: May 20, 2011Filed: May 18, 2012Published: Oct 23, 2014
Est. expiryMay 20, 2031(~4.9 yrs left)· nominal 20-yr term from priority
Inventors:Byoung Gu ChoJae-Sik Min
H10W 90/00H10H 20/8512H10H 20/0361H10H 20/036H10H 29/142H10H 20/8515H10H 20/857H10H 20/8514H10H 20/851H10H 20/85H01L 33/62H01L 2933/0033H01L 27/156H01L 2933/0041H01L 33/505
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Claims

Abstract

A Light Emitting Diode (LED) package comprises a Printed Circuit Board (PCB), an LED mounted on the PCB, a pillar placed higher than the LED around the LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED, and a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting a wavelength of the light emitted from the LED, wherein an electrical pad of the LED and an electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A Light Emitting Diode (LED) package, comprising:
 a Printed Circuit Board (PCB);   an LED mounted on the PCB;   a pillar placed higher than the LED around the LED on the PCB;   a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED; and   a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting a wavelength of the light emitted from the LED,   wherein an electrical pad of the LED and an electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other.   
     
     
         2 . The LED package as claimed in  claim 1 , wherein the fluorescent layer converts the light emitted from the LED into white light by changing a wavelength of the light. 
     
     
         3 . The LED package as claimed in  claim 1 , wherein the LED is disposed within an area corresponding to the fluorescent layer. 
     
     
         4 . The LED package as claimed in  claim 1 , wherein the fluorescent layer includes silicon. 
     
     
         5 . The LED package as claimed in  claim 1 , wherein the pillar reflects the light emitted from the LED in a direction of the LED when the light comes in contact with the pillar. 
     
     
         6 . The LED package as claimed in  claim 1 , wherein a face of the pillar, facing the LED, is formed at a specific angle. 
     
     
         7 . The LED package as claimed in  claim 6 , wherein the face of the pillar, facing the LED, is formed at an angle of about 15° to 90° to the PCB. 
     
     
         8 . The LED package as claimed in  claim 1 , wherein the transparent plate is formed of a lens or a transparent substrate. 
     
     
         9 . The LED package as claimed in  claim 1 , wherein a distance between the fluorescent layer and the LED is about 10 to 20,000 μm. 
     
     
         10 . A Light Emitting Diode (LED) package, comprising:
 a Printed Circuit Board (PCB);   a first LED mounted on the PCB;   a second LED mounted on the PCB and spaced apart from the first LED;   a pillar placed higher than the first LED and the second LED around the first LED and the second LED on the PCB;   a transparent plate disposed on the pillar, spaced apart from the first LED and the second LED, and configured to transmit light emitted from the first LED or the second LED; and   a fluorescent layer formed on a surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the first LED or the second LED,   wherein an electrical pad of the first LED and an electrical pad of the PCB are electrically connected to each other, an electrical pad of the second LED and an electrical pad of the PCB are electrically connected to each other, and the first and second LEDs and the fluorescent layer are spaced apart from each other.   
     
     
         11 . The LED package as claimed in  claim 10 , wherein the fluorescent layer converts the light emitted from the first LED or the second LED into white light by changing a wavelength of the light. 
     
     
         12 . The LED package as claimed in  claim 10 , wherein the first LED and the second LED are disposed within an area corresponding to the fluorescent layer. 
     
     
         13 . The LED package as claimed in  claim 10 , wherein the fluorescent layer includes silicon. 
     
     
         14 . The LED package as claimed in  claim 10 , wherein the pillar reflects the light of the first LED or the second LED in a direction of the first LED or the second LED when the light comes in contact with the pillar. 
     
     
         15 . The LED package as claimed in  claim 10 , wherein a face of the pillar, facing the first LED and the second LED, is formed at a specific angle. 
     
     
         16 . The LED package as claimed in  claim 15 , wherein the face of the pillar, facing the first LED and the second LED, is formed at an angle of about 15° to 90° to the PCB. 
     
     
         17 . The LED package as claimed in  claim 10 , wherein the transparent plate is formed of a lens or a transparent substrate. 
     
     
         18 . The LED package as claimed in  claim 10 , wherein a distance between the fluorescent layer and the first LED and the second LED is about 10 to 20,000 μm. 
     
     
         19 . A Light Emitting Diode (LED) package, comprising:
 a Printed Circuit Board (PCB);   a first LED mounted on the PCB;   a second LED mounted on the PCB and spaced apart from the first LED;   a pillar placed higher than the first LED and the second LED around the first LED and the second LED on the PCB;   a transparent plate disposed on the pillar, spaced apart from the first LED and the second LED, and configured to transmit light emitted from the first LED or the second LED;   a first fluorescent layer formed on a surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the first LED; and   a second fluorescent layer formed on the surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the second LED;   wherein an electrical pad of the first LED and an electrical pad of the PCB are electrically connected to each other, an electrical pad of the second LED and the electrical pad of the PCB are electrically connected to each other, the first LED and the first fluorescent layer are spaced apart from each other, the second LED and the second fluorescent layer are spaced apart from each other, and the first fluorescent layer and the second fluorescent layer are spaced apart from each other.   
     
     
         20 . The LED package as claimed in  claim 19 , wherein the first fluorescent layer converts the light emitted from the first LED into white light by changing a wavelength of the light. 
     
     
         21 . The LED package as claimed in  claim 19 , wherein the second fluorescent layer converts the light emitted from the second LED into white light by changing a wavelength of the light. 
     
     
         22 . The LED package as claimed in  claim 19 , wherein:
 the first LED is disposed within an area corresponding to the first fluorescent layer; and   the second LED is disposed within an area corresponding to the second fluorescent layer.   
     
     
         23 . The LED package as claimed in  claim 18 , wherein the first fluorescent layer or the second fluorescent layer includes silicon. 
     
     
         24 . The LED package as claimed in  claim 19 , wherein the pillar reflects the light of the first LED or the second LED in a direction of the first LED or the second LED when the light comes in contact with the pillar. 
     
     
         25 . The LED package as claimed in  claim 19 , wherein a face of the pillar, facing the first LED and the second LED, is formed at a specific angle. 
     
     
         26 . The LED package as claimed in  claim 25 , wherein the face of the pillar, facing the first LED and the second LED, is formed at an angle of about 15° to 90° to the PCB. 
     
     
         27 . The LED package as claimed in  claim 19 , wherein the transparent plate is formed of a lens or a transparent substrate. 
     
     
         28 . The LED package as claimed in  claim 19 , wherein a distance between the first fluorescent layer and the first LED or a distance between the second fluorescent layer and the second LED is about 10 to 20,000 μm. 
     
     
         29 . A method of manufacturing a Light Emitting Diode (LED) package, the method comprising the steps of:
 mounting an LED on a Printed Circuit Board (PCB), having a pillar formed thereon, within the pillar;   electrically connecting an electrical pad of the PCB and an electrical pad of the LED;   disposing a transparent plate configured to include a fluorescent layer conformably coated with a substance for converting a wavelength of light emitted from the LED and to transmit the light emitted from the LED on the pillar so that the fluorescent layer faces the LED; and   attaching the transparent plate to the pillar.   
     
     
         30 . A method of manufacturing a Light Emitting Diode (LED) package, the method comprising the steps of:
 mounting an LED on a Printed Circuit Board (PCB) having a pillar formed thereon;   electrically connecting an electrical pad of the PCB and an electrical pad of the LED;   disposing a transparent plate configured to include a fluorescent layer conformably coated with a substance for converting a wavelength of light emitted from the LED and to transmit the light emitted from the LED on the pillar so that the fluorescent layer faces the LED;   measuring a wavelength of the light emitted from the LED after the light passes through the transparent plate;   checking whether the light passing through the transparent plate satisfies a specific criterion; and   if, as a result of the check, the light passing through the transparent plate satisfies the specific criterion, attaching the transparent plate to the pillar.

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