Flat panel display apparatus, mother substrate for flat panel display apparatuses, method of manufacturing the flat panel display apparatus, and method of manufacturing the mother substrate
Abstract
A flat panel display apparatus includes a substrate; a display unit disposed on the substrate; a sealing substrate disposed to face the display unit; a sealing member disposed between the substrate and the sealing substrate to surround the display unit; a wiring unit disposed between the substrate and the sealing substrate, including a region that overlaps the sealing member, and including a plurality of wiring members that are spaced apart from each other in at least a portion of the region that overlaps the sealing member; and a lead-in unit connected to the wiring unit to apply a voltage to the wiring unit, and formed to be electrically connectable to an external power source.
Claims
exact text as granted — not AI-modified1 . A flat panel display apparatus comprising:
a substrate; a display unit disposed on the substrate; a sealing substrate disposed to face the display unit; a sealing member disposed between the substrate and the sealing substrate to surround the display unit; a wiring unit disposed between the substrate and the sealing substrate, including a region that overlaps the sealing member, and including a plurality of wiring members that are spaced apart from each other in at least a portion of the region that overlaps the sealing member; and a lead-in unit connected to the wiring unit to apply a voltage to the wiring unit, and formed to be electrically connectable to an external power source.
2 . The apparatus as claimed in claim 1 , wherein the wiring unit including the plurality of spaced-apart wiring members and the sealing member are substantially equal in width.
3 . The apparatus as claimed in claim 1 , wherein the wiring members are formed to be spaced apart from each other in the entire wiring unit.
4 . The apparatus as claimed in claim 3 , wherein the wiring members are connected to the lead-in unit, and
wherein some of the plurality of wiring members include bent portions connected to the lead-in unit.
5 . The apparatus as claimed in claim 1 , wherein the wiring unit surrounds the display unit such that corner regions of the wiring unit are formed and wherein the plurality of wiring members are formed to be spaced apart from each other in at least the corner regions of the wiring unit.
6 . The apparatus as claimed in claim 3 , wherein the lead-in unit includes a plurality of lead-in members connected to the plurality of wiring members.
7 . The apparatus as claimed in claim 3 , wherein the lead-in unit is integrally formed and is connected to ends of all of the plurality of wiring members.
8 . The apparatus as claimed in claim 1 , wherein the wiring unit surrounds the display unit such that corner regions of the wiring unit are formed, and wherein the lead-in unit is connected to the wiring unit at a region between two corners of the wiring unit.
9 . The apparatus as claimed in claim 1 , wherein the wiring unit surrounds the display unit such that corner regions of the wiring unit are formed, and wherein the lead-in unit is connected to the wiring unit at at least one corner of the wiring unit.
10 . (canceled)
11 . (canceled)
12 . The apparatus as claimed in claim 1 , wherein the wiring members are formed on the substrate, and
wherein the sealing member is disposed on and between the wiring members.
13 . The apparatus as claimed in claim 1 , wherein the lead-in unit has a width greater than the width of the wiring unit.
14 . The apparatus as claimed in claim 1 , wherein the wiring unit surrounds the display unit such that corner regions of the wiring unit are formed and wherein the plurality of wiring members include wiring members that curve at the corner regions.
15 . The apparatus as claimed in claim 1 , wherein:
the lead-in unit includes a first lead-in portion and a second lead-in portion, wherein the first lead-in portion and the second lead-in portion are disposed on the substrate at opposite locations with respect to the display unit, the wiring unit includes a first group of spaced apart wiring members that overlap a first portion of the sealing member and extend around the display unit in a first direction to connect with the first lead-in unit portion and the second lead-in unit portion, and a second group of spaced apart wiring members that overlap a second portion of the sealing member and extend around the display unit in a second direction to connect with the first lead-in unit portion and the second lead-in unit portion.
16 . The apparatus as claimed in claim 1 , wherein the sealing member contains frit.
17 . The apparatus as claimed in claim 1 , wherein the display unit includes an organic light emitting device.
18 . A mother substrate for flat panel display apparatuses, the mother substrate comprising:
a substrate; a plurality of display units disposed on the substrate and spaced apart from each other to form a plurality of flat panel display apparatuses; a sealing substrate disposed to face the plurality of display units; a plurality of sealing members disposed between the substrate and the sealing substrate to surround the display units; a plurality of wiring units disposed between the substrate and the sealing substrate and each including a region that overlaps one of the plurality of sealing members; a connection unit containing a conductive material and for connecting neighboring wiring units in one direction; and a lead-in unit connected to the plurality of wiring units to apply a voltage to the plurality of wiring units, and formed to be electrically connectable to an external power source, wherein each of the plurality of wiring units includes a plurality of wiring members that are spaced apart from each other in at least a portion of the region that overlaps the plurality of sealing members.
19 . The mother substrate as claimed in claim 18 , wherein the connection unit has a width greater than the width of the plurality of wiring units.
20 . The mother substrate as claimed in claim 18 , wherein the plurality of wiring units surround respective display units such that corner regions of the wiring units are formed, and wherein the connection unit is connected to corner regions of adjacent ones of the plurality of wiring units.
21 . The mother substrate as claimed in claim 18 , wherein the wiring unit surrounds the display units such that corner regions of the wiring units are formed, and wherein the connection unit is connected to at least one corner region of the plurality of wiring units.
22 . The mother substrate as claimed in claim 21 , wherein the connection unit is bent.
23 . The mother substrate as claimed in claim 18 , wherein the connection unit includes a plurality of connection members connected to the plurality of wiring members.
24 . The mother substrate as claimed in claim 23 , wherein the plurality of connection members have the same length.
25 . The mother substrate as claimed in claim 18 , wherein:
the lead-in unit includes a first lead-in portion and a second lead-in portion, wherein the first lead-in portion and the second lead-in portion are disposed on the substrate at opposite locations with respect to the plurality of display units, the plurality of wiring units includes a first group of spaced apart wiring members that overlap a first portion of a respective sealing member and extend around a respective display unit in a first direction, and a second group of spaced apart wiring members that overlap a second portion of a respective sealing member and extend around a respective display unit in a second direction to connect with the first lead-in unit portion and the second lead-in unit portion, and the lead-in unit and the connection unit connect to both wiring units of the first group and wiring units of the second group.
26 . A method of manufacturing a flat panel display apparatus, the method comprising:
providing a substrate; a display unit disposed on the substrate; a sealing substrate disposed to face the display unit; a sealing member precursor disposed between the substrate and the sealing substrate to surround the display unit; a wiring unit disposed between the substrate and the sealing substrate, including a region that overlaps the sealing member precursor, and including a plurality of wiring members that are spaced apart from each other in at least a portion of the region that overlaps the sealing member precursor; and a lead-in unit connected to the wiring unit to apply a voltage to the wiring unit, and formed to be electrically connectable to an external power source; and forming a sealing member from the sealing member precursor by: electrically connecting a power source to the lead-in unit; applying a voltage from the power source to spaced apart wiring members of the wiring unit; and melting and curing the sealing member precursor using heat generated from the wiring unit.
27 . The method as claimed in claim 26 , wherein the sealing member precursor contains a frit.
28 . (canceled)
29 . A method of manufacturing a mother substrate for flat panel display apparatuses, comprising:
providing a substrate; a plurality of display units disposed on the substrate and spaced apart from each other to form a plurality of flat panel display apparatuses; a sealing substrate disposed to face the plurality of display units; a plurality of sealing member precursor regions disposed between the substrate and the sealing substrate to surround the plurality of display units; a plurality of wiring units disposed between the substrate and the sealing substrate and each including a region that overlaps the plurality of sealing member precursor regions; a connection unit containing a conductive material and that connects neighboring wiring units in one direction; and a lead-in unit connected to the plurality of wiring units to apply a voltage to the plurality of wiring units, and formed to be electrically connectable to an external power source, wherein each of the plurality of wiring units includes a plurality of wiring members that are spaced apart from each other in at least a portion of the region that overlaps the plurality of sealing member precursor regions, and forming a plurality of sealing members in the plurality of sealing member precursor regions by:
electrically connecting a power source to the lead-in unit;
applying a voltage from the power source to the plurality of wiring units; and
melting and curing the plurality of sealing member precursor regions using heat generated from the plurality of wiring units.
30 . The method as claimed in claim 29 , wherein the plurality of sealing member precursor regions contain a frit.
31 . The method as claimed in claim 29 , wherein the connection unit includes a plurality of connection members connected to the plurality of wiring members, and
wherein, when the power source applies a voltage, the plurality of connection members have the same voltage drop.
32 . The method as claimed in claim 29 , wherein the plurality of connection members have the same length.Join the waitlist — get patent alerts
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