Heat-reactive resist material, mold manufacturing method, mold, development method and pattern formation material

Abstract

A heat-reactive resist material contains copper oxide, and silicon or silicon oxide, and is formed so that the content of silicon or silicon oxide in the heat-reactive resist material is 4.0 mol % or more less than 10.0 mol % in terms of mole of silicon. A heat-reactive resist layer is formed using the heat-reactive resist material, is exposed, and then, is developed with a developing solution. Using the obtained heat-reactive resist layer as a mask, dry etching is performed on a substrate with a fluorocarbon to manufacture a mold having a concavo-convex shape on the substrate surface. At this point, it is possible to control a fine pattern comprised of the concavo-convex shape.

1 . A heat-reactive resist material containing copper oxide, and silicon or silicon oxide,
 wherein a content of the silicon or the silicon oxide in the heat-reactive resist material is 4.0 mol % or more to less than 10.0 mol % in terms of mole of silicon.   
     
     
         2 . The heat-reactive resist material according to  claim 1 , wherein the content of the silicon or the silicon oxide in the heat-reactive resist material ranges from 4.0 mol % to 8.5 mol % in terms of mole of silicon. 
     
     
         3 . The heat-reactive resist material according to  claim 1 , wherein the content of the silicon or the silicon oxide in the heat-reactive resist material ranges from 6.5 mol % to 8.5 mol % in terms of mole of silicon. 
     
     
         4 . A manufacturing method for manufacturing a mold having a concavo-convex shape on a substrate surface using the heat-reactive resist material according to  claim 1 , including:
 a step (1) of forming a heat-reactive resist layer on the substrate using the heat-reactive resist material;   a step (2) of exposing the heat-reactive resist layer, and then, developing with a developing solution;   a step (3) of performing dry etching on the substrate with a fluorocarbon using the heat-reactive resist layer as a mask; and   a step (4) of removing the heat-reactive resist layer, wherein the developing solution is a glycine solution or a mixed solution of glycine and ammonium oxalate.   
     
     
         5 . The manufacturing method of the mold according to  claim 4 , wherein a film thickness of the heat-reactive resist layer ranges from 10 nm to 50 nm. 
     
     
         6 . The manufacturing method of the mold according to  claim 4 , wherein a film thickness of the heat-reactive resist layer ranges from 20 nm to 30 nm. 
     
     
         7 . The manufacturing method of the mold according to  claim 4 , wherein the heat-reactive resist layer is formed by a method selected from among a sputtering method, a vapor deposition method and a CVD method. 
     
     
         8 . The manufacturing method of the mold according to  claim 4 , wherein the substrate is in the shape of a plate. 
     
     
         9 . The manufacturing method of the mold according to  claim 4 , wherein the substrate is in the shape of a sleeve. 
     
     
         10 . The manufacturing method of the mold according to  claim 4 , wherein the substrate is quartz glass. 
     
     
         11 . The manufacturing method of the mold according to  claim 4 , wherein exposure in the step (2) is performed using a semiconductor laser. 
     
     
         12 . A mold manufactured by the manufacturing method of the mold according to  claim 4 . 
     
     
         13 . The mold according to  claim 12 , wherein the mold has a fine pattern ranging from 1 nm to 1 μm. 
     
     
         14 . A development method for developing the heat-reactive resist material according to  claim 1 , including:
 a step (1) of forming a heat-reactive resist layer on a substrate using the heat-reactive resist material; and   a step (2) of exposing the heat-reactive resist layer, and then, developing with a developing solution,   wherein the developing solution is a glycine solution or a mixed solution of glycine and ammonium oxalate.   
     
     
         15 . A pattern formation material comprised of a combination of the heat-reactive resist material according to  claim 1 , and a developing solution comprised of a glycine solution or a mixed solution of glycine and ammonium oxalate. 
     
     
         16 . A manufacturing method for manufacturing a mold having a concavo-convex shape on a substrate surface using the heat-reactive resist material according to  claim 2 , including:
 a step (1) of forming a heat-reactive resist layer on the substrate using the heat-reactive resist material;   a step (2) of exposing the heat-reactive resist layer, and then, developing with a developing solution;   a step (3) of performing dry etching on the substrate with a fluorocarbon using the heat-reactive resist layer as a mask; and   a step (4) of removing the heat-reactive resist layer, wherein the developing solution is a glycine solution or a mixed solution of glycine and ammonium oxalate.   
     
     
         17 . A manufacturing method for manufacturing a mold having a concavo-convex shape on a substrate surface using the heat-reactive resist material according to  claim 3 , including:
 a step (1) of forming a heat-reactive resist layer on the substrate using the heat-reactive resist material;   a step (2) of exposing the heat-reactive resist layer, and then, developing with a developing solution;   a step (3) of performing dry etching on the substrate with a fluorocarbon using the heat-reactive resist layer as a mask; and   a step (4) of removing the heat-reactive resist layer, wherein the developing solution is a glycine solution or a mixed solution of glycine and ammonium oxalate.   
     
     
         18 . The manufacturing method of the mold according to  claim 5 , wherein the heat-reactive resist layer is formed by a method selected from among a sputtering method, a vapor deposition method and a CVD method. 
     
     
         19 . The manufacturing method of the mold according to  claim 6 , wherein the heat-reactive resist layer is formed by a method selected from among a sputtering method, a vapor deposition method and a CVD method. 
     
     
         20 . The manufacturing method of the mold according to  claim 5 , wherein the substrate is in the shape of a plate.