US2014329110A1PendingUtilityA1
Methods of maintaining and using a high concentration of dissolved copper on the surface of a useful article
Est. expiryMay 23, 2026(expired)· nominal 20-yr term from priority
A01N 25/34C22F 1/08Y10T428/12993C22C 9/04A61K 31/30C22C 9/00A01N 59/20A61P 31/02A01N 25/08B21B 45/00A61L 2/238C21D 1/26A01N 2300/00Y02A50/30
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Claims
Abstract
A method for maintaining and using a high concentration of dissolved copper on a surface of a useful article by providing a copper surface without coatings thereon which increase the wetting angle and which isolate the copper surface and which has a surface roughness between 2 and 50 micro inches Ra, so as to kill microbes thereon.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A product comprising:
a copper alloy comprising a contact surface which provides copper ions or produces a copper oxide, or both, said contact surface having a roughness of between about 6 and about 14 microinches Ra; wherein the contact surface is not coated with a polymer finish, barrier coating, tarnish inhibitor, oil, grease, or wax; and wherein the contact surface has a lower contact angle, a higher rate of copper evolution into aqueous solution, and a higher rate of microbial inactivation, as compared to a copper alloy contact surface coated with benzotriazole.
2 . The product of claim 1 wherein the surface roughness is about 10 microinches Ra.
3 . The product of claim 1 wherein the copper alloy is copper.
4 . The product of claim 1 wherein the copper alloy is copper alloy C110.
5 . The product of claim 1 wherein the aqueous solution is an artificial sweat formulation.
6 . The product of claim 1 wherein the higher rate of copper evolution into aqueous solution is at least 10 times higher.
7 . The product of claim 6 wherein the higher rate of copper evolution into aqueous solution is at least 30 times higher.
8 . The product of claim 1 wherein the contact surface is chemically etched.
9 . The product of claim 1 , wherein the higher rate of microbial inactivation comprises a reduction in E. coli by at least 99% within about 60 minutes.
10 . The product of claim 9 wherein the higher rate of microbial inactivation comprises a reduction in E. coli by at least 99% within about 45 minutes.
11 . The product of claim 10 , wherein the higher rate of microbial inactivation comprises a reduction in E. coli by at least 99% within about 30 minutes.
12 . The product of claim 1 , wherein said product is a rolled strip, hospital touch surface, or lighting device or control.
13 . A product comprising:
a copper alloy comprising a contact surface which provides copper ions or produces a copper oxide, or both, said contact surface having a roughness of between about 6 and about 14 microinches Ra; wherein the contact surface is not coated with a polymer finish, barrier coating, tarnish inhibitor, oil, grease, or wax; and wherein the contact surface has a higher rate of copper evolution into aqueous solution as compared to a copper alloy contact surface coated with benzotriazole.
14 . The product of claim 13 wherein the surface roughness is about 10 microinches Ra.
15 . The product of claim 13 wherein the copper alloy is copper.
16 . The product of claim 13 wherein the copper alloy is copper alloy C110.
17 . The product of claim 13 wherein the aqueous solution is an artificial sweat formulation.
18 . The product of claim 13 wherein the higher rate of copper evolution into aqueous solution is at least 10 times higher.
19 . The product of claim 18 wherein the higher rate of copper evolution into aqueous solution is at least 30 times higher.
20 . The product of claim 13 wherein said product is a rolled strip, hospital touch surface, or lighting device or control.
21 . A product comprising:
a copper alloy comprising a contact surface which provides copper ions or produces a copper oxide, or both, said contact surface having a roughness of between about 6 and about 14 microinches Ra; wherein the contact surface is not coated with a polymer finish, barrier coating, tarnish inhibitor, oil, grease, or wax; and wherein the contact surface has a higher rate of microbial inactivation as compared to a copper alloy contact surface coated with benzotriazole.
22 . The product of claim 21 wherein the surface roughness is about 10 microinches Ra.
23 . The product of claim 21 wherein the copper alloy is copper.
24 . The product of claim 21 wherein the copper alloy is copper alloy C110.
25 . The product of claim 21 , wherein the higher rate of microbial inactivation comprises a reduction in E. coli by at least 99% within about 60 minutes.
26 . The product of claim 25 wherein the higher rate of microbial inactivation comprises a reduction in E. coli by at least 99% within about 45 minutes.
27 . The product of claim 26 , wherein the higher rate of microbial inactivation comprises a reduction in E. coli by at least 99% within about 30 minutes.
28 . The product of claim 21 , wherein the higher rate of microbial inactivation comprises a 3 log 10 reduction in CFU that is at least about 40% to about 60% faster as compared to the copper alloy contact surface coated with benzotriazole.
29 . The product of any claim 21 , wherein said product is a rolled strip, hospital touch surface, or lighting device or control.
30 . A product comprising:
a touch surface comprising a copper alloy which provides copper ions or produces a copper oxide, or both, said touch surface having a roughness of between about 6 and about 14 microinches Ra; wherein the touch surface is not coated with a polymer finish, barrier coating, tarnish inhibitor, oil, grease, or wax; and wherein the touch surface has a lower contact angle, a rate of copper evolution into aqueous solution that is at least 15 to 25 times higher, and a rate of microbial inactivation comprising a 3 log 10 reduction in CFU that is at least about 40% to about 60% faster, as compared to a copper alloy contact surface coated with benzotriazole.
31 . The product of claim 30 , wherein the touch surface is a hospital touch surface.
32 . A product comprising:
a rolled strip comprising a copper alloy, said copper alloy comprising a contact surface which provides copper ions or produces a copper oxide, or both, and said contact surface having a roughness of between about 6 and about 14 microinches Ra; wherein the contact surface is not coated with a polymer finish, barrier coating, tarnish inhibitor, oil, grease, or wax; and wherein the contact surface has a lower contact angle, a rate of copper evolution into aqueous solution that is at least 15 to 25 times higher, and a rate of microbial inactivation comprising a 3 log 10 reduction in CFU that is at least about 40% to about 60% faster, as compared to a copper alloy contact surface coated with benzotriazole.Join the waitlist — get patent alerts
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