Methods of maintaining and using a high concentration of dissolved copper on the surface of a useful article

Abstract

A method for maintaining and using a high concentration of dissolved copper on a surface of a useful article by providing a copper surface without coatings thereon which increase the wetting angle and which isolate the copper surface and which has a surface roughness between 2 and 50 micro inches Ra, so as to kill microbes thereon.

What is claimed is: 
     
         1 . A method of making a copper alloy product comprising:
 a.) providing a copper alloy comprising at least one surface;   b.) processing the surface to a roughness of between about 6 and about 14 microinches Ra;   c.) degreasing the surface; and   d.) drying the surface;   wherein said method does not include coating the surface with a polymer finish, barrier coating, tarnish inhibitor, oil, or wax.   
     
     
         2 . The method of  claim 1 , wherein the roughness is about 10 microinches Ra. 
     
     
         3 . The method of  claim 1 , wherein the copper alloy is copper. 
     
     
         4 . The method of  claim 1 , wherein the copper alloy is copper alloy C110. 
     
     
         5 . The method of  claim 1 , wherein the processing of the surface is performed by chemical etching. 
     
     
         6 . The method of  claim 1 , further comprising treating the surface with an acid or oxidizing agent, or both. 
     
     
         7 . The method of  claim 6 , wherein the surface is treated with sulfuric acid. 
     
     
         8 . The method of  claim 7 , wherein the surface is treated with hydrogen peroxide. 
     
     
         9 . The method of  claim 8 , wherein the sulfuric acid is an amount of about 10 to about 20% and the hydrogen peroxide is in an amount of about 1 to about 3%. 
     
     
         10 . The method of  claim 1 , where said drying is by forced air drying. 
     
     
         11 . The method of  claim 1 , wherein the surface is heated subsequent to said drying. 
     
     
         12 . The method of  claim 11 , wherein the heating is by furnace treatment. 
     
     
         13 . The method of  claim 12 , wherein the furnace treatment is for a period of about 5 minutes to about 2 hours. 
     
     
         14 . The method of  claim 12 , wherein the furnace treatment is at a temperature of between about 200° C. and about 400° C. in air. 
     
     
         15 . The method of  claim 12 , wherein the furnace treatment is for a period of about 5 minutes and at a temperature of about 400° C. in air. 
     
     
         16 . The method of  claim 12 , wherein the furnace treatment is for a period of about 2 hours and at a temperature of about 200° C. in air. 
     
     
         17 . A copper alloy product produced by the method of  claim 1 , wherein the surface is a contact surface having a lower contact angle as compared to a copper alloy contact surface coated with benzotriazole. 
     
     
         18 . A copper alloy product produced by the method of  claim 1 , wherein the surface is a contact surface having a higher rate of copper evolution into aqueous solution as compared to a copper alloy contact surface coated with benzotriazole. 
     
     
         19 . A copper alloy product produced by the method of  claim 1 , wherein the surface is a contact surface having a higher rate of microbial inactivation as compared to a copper alloy contact surface coated with benzotriazole. 
     
     
         20 . The method of  claim 1 , wherein the copper alloy product is a rolled strip, hospital touch surface, or lighting device or control. 
     
     
         21 . The method of  claim 20 , wherein the copper alloy product is a rolled strip. 
     
     
         22 . A method of making a copper alloy product comprising:
 a.) providing a copper alloy comprising at least one surface;   b.) processing the surface to a roughness of between about 6 and about 14 microinches Ra;   c.) degreasing the surface;   d.) treating the surface with sulfuric acid and hydrogen peroxide;   e.) drying the surface by forced air drying; and   f.) furnace treating the surface for a period of about 5 minutes and at a temperature of about 400° C. in air;   wherein said method does not include coating the surface with a polymer finish, barrier coating, tarnish inhibitor, oil, or wax; and   wherein the copper alloy product is a rolled strip.   
     
     
         23 . The method of  claim 22 , wherein the roughness is about 10 microinches Ra. 
     
     
         24 . The method of  claim 22 , wherein the sulfuric acid is an amount of about 10 to about 20% and the hydrogen peroxide is in an amount of about 1 to about 3%. 
     
     
         25 . The product produced by the method of  claim 1 .