Article with metal grid composite and methods of preparing

Abstract

A laminate donor element can be used to transfer a composite of a metal grid and an electronically conductive polymer to a receiver sheet for use in various devices. The laminate donor element has a donor substrate, a metal grid that is disposed over only portions of the donor substrate, leaving portions of the substrate uncovered by the metal grid, and an electronically conductive polymer that covers the portions of the donor substrate that are uncovered by the metal grid. The composite of metal grid and electronically conductive polymer exhibits a peel force of less than or equal to 40 g/cm for separation from the donor substrate at room temperature. The resulting article has a substrate on which a reverse composite of the metal grid and electronically conductive polymer is disposed, which article can be incorporated into various devices.

1 . A method of forming an article comprising a metal grid, the method comprising:
 under heat, pressure, or both heat and pressure, forming as assembly of a laminate donor element and a receiver sheet,
 the laminate donor element comprising, in order:
 a donor substrate, 
 a metal grid comprising two or more metal lines that are in direct contact with only portions of the donor substrate, leaving portions of the donor substrate uncovered by the metal grid, and 
 an electronically conductive polymer layer that directly covers the portions of the donor substrate uncovered by the metal grid, and optionally directly covers at least some of the metal grid, thereby forming a composite of metal grid and electronically conductive polymer, and 
 
   transferring the composite of metal grid and electronically conductive polymer from the donor substrate to the receiver sheet so that the receiver sheet has thereon a reverse composite comprising the electronically conductive polymer layer and the metal grid such that the metal grid is disposed on the receiver sheet and the voids of the metal grid are filled by the electronically conductive polymer, and at least some of the metal grid is uncovered.   
     
     
         2 . The method of  claim 1  wherein there is an adhesive layer disposed between the donor substrate and the receiver substrate. 
     
     
         3 . The method of  claim 1  wherein the composite transferring is carried out using pressure applied by acoustic or mechanical force. 
     
     
         4 . The method of  claim 1  where the transferring is carried out using a source of radiation. 
     
     
         5 . The method of  claim 1  wherein the receiver sheet comprises a receiver substrate that is a transparent and flexible polymer or flexible glass. 
     
     
         6 . The method of  claim 1  wherein the metal grid comprises a plurality of silver lines and the electronically conductive polymer is a substituted or unsubstituted thiophene-containing polymer. 
     
     
         7 . The method of  claim 1  wherein the composite of metal grid and electronically conductive polymer layer exhibits a peel force of less than or equal to 40 g/cm for separation from the donor substrate at room temperature. 
     
     
         8 . The method of  claim 1  wherein the transferring is carried out by peeling the laminate donor substrate away from the assembly. 
     
     
         9 . The method of  claim 1 , wherein the metal grid comprises two or more metal lines comprising at least one metal selected from the group consisting of silver, gold, copper, platinum, palladium, indium, tin, aluminum, and mixtures thereof. 
     
     
         10 . The method of  claim 1 , wherein the donor substrate comprises a flexible polymer or a flexible glass. 
     
     
         11 . The method of  claim 1 , wherein the metal grid comprises a plurality of silver, gold, copper, platinum, palladium, indium, tin, aluminum lines, covering at least 0.01% and up to and including 90% of the donor substrate surface area. 
     
     
         12 . The method of  claim 1 , wherein the donor substrate and receiver sheet are transparent and composed of the same or different flexible polymer or flexible glass. 
     
     
         13 . The method of  claim 2 , wherein the adhesive layer comprises an epoxy, acrylate polymer, polyurethane, polyester, polyolefin, polycarbonate, polysiloxane, or a mixture thereof. 
     
     
         14 . The method of  claim 2 , wherein the metal grid is disposed directly on the adhesive layer. 
     
     
         15 . The method of  claim 1 , wherein the donor substrate further comprises a release material or layer on its surface and that is in contact with the composite of metal grid and electronically conductive polymer. 
     
     
         16 . The method of  claim 1 , wherein the metal grid comprises printed metal particles. 
     
     
         17 . The method of  claim 16 , wherein the metal grid comprises printed metal nanoparticles. 
     
     
         18 . The method of  claim 1 , wherein the electronically conductive polymer layer covers less than 10% of the metal grid surface area. 
     
     
         19 . The method of  claim 1 , wherein the laminate donor element and the receiver sheet are brought into intimate contact to form the assembly.