Detection apparatus and method of chemical mechanical polishing conditioner
Abstract
The present invention relates to a detection apparatus of chemical mechanical polishing conditioner, comprising: a working platform with a working plane; a placement base disposed on the working plane of the working platform, for carrying a chemical mechanical polishing conditioner; an image capture device forming one or a plurality of captured images on different regions of the chemical mechanical polishing conditioner; a display device; an image recognition module, wherein the captured images are performed a color matching by the image recognition module to determine one or a plurality of risk diamonds on the chemical mechanical polishing conditioner, and the coordinate location of the risk diamonds are outputted into the display device; and a mobile platform for moving the risk diamonds to specified locations. A detection method of the above mentioned detection apparatus is also disclosed.
Claims
exact text as granted — not AI-modified1 . A detection apparatus of a chemical mechanical polishing conditioner, comprising:
a working platform with a working plane; a placement base disposed on the working plane of the working platform, for carrying a chemical mechanical polishing conditioner; an image capture device disposed on the placement base of working platform, and the image capture device and the placement base parallel to the working platform, wherein one or a plurality of captured images on different regions of the chemical mechanical polishing conditioner is formed by the image capture device; a display device; an image recognition module electrically connected to the image capture device and the display device, wherein the captured images is performed a color matching by the image recognition module to determine one or a plurality of risk diamonds on the chemical mechanical polishing conditioner, and the coordinate locations of the risk diamonds are outputted to the display device; and a mobile platform made the risk diamond move to a specified location.
2 . The detection apparatus of a chemical mechanical polishing conditioner of claim 1 , wherein the image capture device is a charge coupled device (CCD) or an industrial camera.
3 . The detection apparatus of a chemical mechanical polishing conditioner of claim 1 , wherein the placement base and the image capture device are located on the working plane and removed freely.
4 . The detection apparatus of a chemical mechanical polishing conditioner of claim 1 , wherein the detection apparatus further comprise a light source device disposed over the placement base and irradiated light toward the chemical mechanical polishing conditioner.
5 . The detection apparatus of a chemical mechanical polishing conditioner of claim 1 , wherein the image capture device is a color formatting data.
6 . The detection apparatus of a chemical mechanical polishing conditioner of claim 1 , wherein the risk diamonds are diamond particles capable of reflecting incident light.
7 . The detection apparatus of a chemical mechanical polishing conditioner of claim 6 , wherein the diamond particles have twin crystal structures or internal crack structures.
8 . The detection apparatus of a chemical mechanical polishing conditioner of claim 6 , wherein the diamond particles are yellow diamonds including nitrogen-containing dopants.
9 . The detection apparatus of a chemical mechanical polishing conditioner of claim 1 , wherein the risk diamonds are shown yellow color in the image capture device.
10 . The detection apparatus of a chemical mechanical polishing conditioner of claim 1 , wherein the image recognition module determines the risk diamonds shown yellow color through the color matching.
11 . The detection apparatus of a chemical mechanical polishing conditioner of claim 1 , wherein the detection apparatus further comprise a removing device for removing the risk diamonds from the chemical mechanical polishing conditioner.
12 . The detection apparatus of a chemical mechanical polishing conditioner of claim 1 , wherein the removing device is a high-power laser, a water jet device, an endpoint oscillator or an artificial shave tool.
13 . A detection method of a chemical mechanical polishing conditioner, wherein the chemical mechanical polishing conditioner is performed a detection to determine one or a plurality of risk diamonds on the chemical mechanical polishing conditioner through the detection apparatus of a chemical mechanical polishing conditioner according to claim 1 .Cited by (0)
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