Plating device

Abstract

Disclosed is a plating device that has a plating tank that retains a plating fluid and carries out magnetic metal plating on a shaft shaped member immersed in the plating fluid as a negative electrode. The plating device is provided with: a plurality of shielding jigs that are fitted to the outer peripheral surface of the shaft shaped member and regulate the part of the shaft shaped member being plated; and a positive electrode provided in the vicinity of the shaft shaped member and having an output part that faces the part being plated. A center position in the axial direction of the shaft shaped member for the part being plated and a center position of the output part are aligned within a prescribed allowable value for the center positions.

1 . A plating device comprising a plating tank retaining a plating fluid, the device being used to carry out magnetic alloy plating of a shaft-shaped member immersed in the plating fluid, the shaft-shaped member serving as a negative electrode, wherein the plating device includes
 a plurality of shielding jigs fitted about an outer peripheral surface of the shaft-shaped member and defining a plated portion on the shaft-shaped member; and   a positive electrode disposed surrounding the shaft-shaped member, and having an output portion facing the plated portion;   characterized in that the center position of the plated portion and the center position of the output portion in the axial direction of the shaft-shaped member are aligned to within a predetermined tolerance relating to the center position.   
     
     
         2 . The plating device of  claim 1 , wherein a length of the plated portion and a length of the output portion of the positive electrode are aligned to within a predetermined tolerance relating to the length, in an axial direction of the shaft-shaped member. 
     
     
         3 . The plating device of  claim 1 , further comprising a shield disposed between the positive electrode and the shaft-shaped member. 
     
     
         4 . The plating device of  claim 3 , wherein a pattern of the shield defines a pattern of the output portion of the positive electrode, the pattern of the shield being determined such that variability of thickness of the magnetic alloy plating is kept to within an allowable range. 
     
     
         5 . The plating device of  claim 3 , wherein the shield is of assembly type detachable from the positive electrode. 
     
     
         6 . The plating device of  claim 1 , further comprising a plating fluid spray nozzle having a plating fluid spray orifice facing the plated portion, the plating fluid spray nozzle being of assembly type detachable from the plating tank. 
     
     
         7 . The plating device of  claim 6 , wherein the center position of the plated portion and the center position of the plating fluid spray orifice are aligned to within an tolerance relating to the center position, in the axial direction of the shaft-shaped member. 
     
     
         8 . The plating device of  claim 7 , wherein the length of the plated portion and the length of the plating fluid spray orifice are aligned to within a prescribed tolerance relating to the length, in the axial direction of the shaft-shaped member. 
     
     
         9 . The plating device of  claim 2 , further comprising a shield disposed between the positive electrode and the shaft-shaped member. 
     
     
         10 . The plating device of  claim 4 , wherein the shield is of assembly type detachable from the positive electrode. 
     
     
         11 . The plating device of  claim 2 , further comprising a plating fluid spray nozzle having a plating fluid spray orifice facing the plated portion, the plating fluid spray nozzle being of assembly type detachable from the plating tank. 
     
     
         12 . The plating device of  claim 3 , further comprising a plating fluid spray nozzle having a plating fluid spray orifice facing the plated portion, the plating fluid spray nozzle being of assembly type detachable from the plating tank. 
     
     
         13 . The plating device of  claim 4 , further comprising a plating fluid spray nozzle having a plating fluid spray orifice facing the plated portion, the plating fluid spray nozzle being of assembly type detachable from the plating tank. 
     
     
         14 . The plating device of  claim 5 , further comprising a plating fluid spray nozzle having a plating fluid spray orifice facing the plated portion, the plating fluid spray nozzle being of assembly type detachable from the plating tank.