Polishing pad

Abstract

A polishing pad at least includes a polishing layer, and a cushion layer, in which a plurality of holes is provided in the polishing layer, the holes passing through the polishing layer in a thickness direction, and a plurality of grooves is provided in a polishing surface of the polishing layer, a through hole ratio is from 0.13% or more to 2.1% or less, and angles made by the polishing surface and side surfaces of the groove, which continue to the polishing surface, is from 105 degrees or more to 150 degrees or less.

1 . A polishing pad at least comprising:
 a polishing layer; and   a cushion layer,   wherein a plurality of holes is provided in the polishing layer, the holes passing through the polishing layer in a thickness direction, and a plurality of grooves is provided in a polishing surface of the polishing layer,   a through hole ratio is from 0.13% or more to 2.1% or less, and   angles of both side surfaces of the groove, the angles being made by the polishing surface and the side surfaces continuing to the polishing surface, are from 105 degrees or more to 150 degrees or less.   
     
     
         2 . The polishing pad according to  claim 1 , wherein the grooves in a surface of the polishing layer have a lattice shape.