Thermal Transfer Device with Reduced Vertical Profile

Abstract

A thermal transfer device having a reduced vertical profile. The device includes a condenser with substantially vertical internal cooling fins. An inlet conducts a thermal transfer fluid in a vapor state to the tops of the cooling fins where the vapor condenses and flows down the fins to the bottom of the condenser. The bottom of the condenser is angled towards an outlet for conducting the liquid thermal transfer fluid to a reservoir for holding the fluid. The inlet and the outlet are both positioned at a height above the level of the thermal transfer fluid in liquid state in the reservoir. The device may also include fins on the exterior of the condenser for providing cooling surfaces which do not contact the thermal transfer fluid in either the liquid or vapor states.

What is claimed is: 
     
         1 . A condenser for use in a thermal transfer device and adapted to be coupled to a reservoir for holding a thermal transfer fluid in at least one of a liquid state and a vapor state, the condenser comprising:
 an inlet for receiving the thermal transfer fluid in a vapor state from the reservoir;   an outlet for returning the thermal transfer fluid to the reservoir in a liquid state; and   first and second header spaces;   said inlet being positioned at a height relative to the reservoir which is greater than a height of said outlet and being configured to introduce the thermal transfer fluid in said vapor state to said first header space;   said outlet being configured to conduct the thermal transfer fluid in said liquid state from said second header space;   each of said inlet and said outlet being positioned at a height above a level of the thermal transfer fluid in its liquid state in the reservoir;   an array of substantially vertical fins disposed within the condenser;   wherein said fins define passages therebetween, said passages opening into said first and second header spaces and permitting the flow of the thermal transfer fluid therethrough.   
     
     
         2 . The condenser of  claim 1 , wherein said first and second header spaces are separated from each other. 
     
     
         3 . The condenser in  claim 1  wherein said first and second header spaces comprise one header space 
     
     
         4 . The condenser of  claim 1 , wherein said inlet and said outlet form a single conduit. 
     
     
         5 . The condenser of  claim 1 , wherein said inlet and said outlet are on the same side of said condenser. 
     
     
         6 . The condenser of  claim 1 , wherein said condenser has a bottom surface positioned so that it slopes in a direction of said outlet to facilitate the flow of the thermal transfer fluid to said outlet when the thermal transfer fluid is in its liquid state. 
     
     
         7 . The condenser of  claim 1 , wherein each of said fins has a plurality of flutes on at least one side thereof. 
     
     
         8 . The condenser of  claim 7 , wherein said flutes are on opposing sides of said fins. 
     
     
         9 . The condenser of  claim 8 , wherein said flutes are disposed in matched pairs on said opposing sides of said fins. 
     
     
         10 . The condenser of  claim 8 , wherein said flutes are disposed on said opposing sides of said fins in a staggered relationship. 
     
     
         11 . The condenser of  claim 1 , wherein the depth of said condenser is greater than the height, thereby permitting the thermal transfer device to have a reduced vertical profile. 
     
     
         12 . The condenser of  claim 1 , further comprising a second plurality of fins on the exterior of said condenser, said second plurality of fins not being in contact with the thermal transfer fluid in either its liquid or vapor state. 
     
     
         13 . The condenser of  claim 1 , further comprising a liquid cold plate in at least one of above or below the condenser chamber in thermal communication with said chamber. 
     
     
         14 . A thermal transfer device for use in an environment with a small vertical clearance, the device comprising:
 a reservoir for holding a thermal transfer fluid in a liquid state;   a condenser having
 an inlet for receiving the thermal transfer fluid in a vapor state from said reservoir; 
 an outlet for returning the thermal transfer fluid to said reservoir in the liquid state; and 
 first and second header spaces; 
 said inlet being positioned above said outlet and being configured to introduce the thermal transfer fluid in its vapor state to said first header space; 
 said outlet being configured to conduct the thermal transfer fluid in its liquid state from said second header space; 
 each of said inlet and said outlet being positioned at a height above a level of the thermal transfer fluid in its liquid state in said reservoir; and 
   an array of substantially vertical fins disposed within said condenser;   wherein said fins define passages therebetween, said passages opening into said first and second header spaces and permitting the flow of the thermal transfer fluid therethrough;   whereby the thermal transfer fluid in its vapor state may enter the condenser through said inlet into said first header space, whereupon it flows through the tops of said passages to contact said fins, where the vapor condenses, whereupon it flows back through the bottom of said passages to said second header space and then to said outlet for return to the reservoir.   
     
     
         15 . The thermal transfer device of  claim 14 , further comprising a first conduit for conducting the thermal transfer fluid from said reservoir to said inlet. 
     
     
         16 . The thermal transfer device of  claim 15 , wherein said first conduit is adapted to conduct the thermal transfer fluid in its vapor state from said reservoir to said inlet. 
     
     
         17 . The thermal transfer device of  claim 15 , further comprising a second conduit for conducting the condensed thermal transfer fluid in its liquid state from said outlet to said reservoir. 
     
     
         18 . The thermal transfer of  claim 14 , wherein said condenser has a bottom surface positioned so that it slopes in the direction of said outlet to facilitate the flow of the thermal transfer fluid to said outlet when the thermal transfer fluid is in its liquid state. 
     
     
         19 . The thermal transfer device of  claim 14 , wherein each of said fins has a plurality of flutes on at least one side thereof. 
     
     
         20 . The thermal transfer device of  claim 14 , further comprising a second plurality of fins on the exterior of said condenser, said second plurality of fins not being in contact with the thermal transfer fluid in either its liquid or vapor state. 
     
     
         21 . The thermal transfer device of  claim 14 , wherein the depth of said condenser is greater than the height thereof, thereby permitting the thermal transfer device to have a reduced vertical profile. 
     
     
         22 . The thermal transfer device of  claim 14 , further comprising: means for attaching an external thermal transfer apparatus to the thermal transfer device to provide thermal contact with said condenser, and to provide additional thermal transfer capacity to the thermal transfer device. 
     
     
         23 . The thermal transfer device of  claim 22 , further comprising a thermal transfer medium applied to the exterior of said condenser to provide thermal conduction between the thermal transfer apparatus and said condenser. 
     
     
         24 . The thermal transfer device of  claim 23 , wherein said thermal transfer medium is selected from one of a thermally conductive pad, a thermally conductive gel and a thermally conductive grease. 
     
     
         25 . The thermal transfer device of  claim 22 , wherein said means for attaching includes a spring which urges the external thermal transfer apparatus into contact with said condenser. 
     
     
         26 . The thermal transfer device of  claim 22 , further comprising a barrier component. 
     
     
         27 . The thermal transfer device of  claim 26 , wherein said barrier component is one wall of an enclosure. 
     
     
         28 . The thermal transfer device of  claim 27 , wherein said enclosure substantially surrounds said thermal transfer device. 
     
     
         29 . The thermal transfer device of  claim 27 , wherein said enclosure substantially surrounds said reservoir of said thermal transfer device.